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| 型号： | DSP56303AG100 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 94/108页 |
| 文件大小： | 0K |
| 描述： | IC DSP 24BIT 100MHZ 144-LQFP |
| 特色产品： | DSP56303 24-bit Digital Signal Processor |
| 标准包装： | 60 |
| 系列： | DSP563xx |
| 类型： | 定点 |
| 接口： | 主机接口，SSI，SCI |
| 时钟速率： | 100MHz |
| 非易失内存： | ROM（576 B） |
| 芯片上RAM： | 24kB |
| 电压 - 输入/输出： | 3.30V |
| 电压 - 核心： | 3.30V |
| 工作温度： | -40°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 144-LQFP |
| 供应商设备封装： | 144-LQFP（20x20） |
| 包装： | 托盘 |
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DSP56303 Technical Data, Rev. 11
4-2
Freescale Semiconductor
Design Considerations
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
If the temperature of the package case (TT) is determined by a thermocouple, thermal resistance is
computed from the value obtained by the equation (TJ – TT)/PD.
As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using the first
definition. From a practical standpoint, that value is also suitable to determine the junction temperature from a case
thermocouple reading in forced convection environments. In natural convection, the use of the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will
yield an estimate of a junction temperature slightly higher than actual temperature. Hence, the new thermal metric,
thermal characterization parameter or
ΨJT, has been defined to be (TJ – TT)/PD. This value gives a better estimate of
the junction temperature in natural convection when the surface temperature of the package is used. Remember that
surface temperature readings of packages are subject to significant errors caused by inadequate attachment of the
sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-
gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
4.2 Electrical Design Considerations
Use the following list of recommendations to ensure correct DSP operation.
Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the
board ground to each GND pin.
Use at least six 0.01–0.1
F bypass capacitors positioned as close as possible to the four sides of the
package to connect the VCC power source to GND.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and GND pins
are less than 0.5 inch per capacitor lead.
Use at least a four-layer PCB with two inner layers for VCC and GND.
Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal. This
recommendation particularly applies to the address and data buses as well as the IRQA, IRQB, IRQC, IRQD,
TA
, and BG pins. Maximum PCB trace lengths on the order of 6 inches are recommended.
CAUTION
This device contains protective circuitry to
guard against damage due to high static
voltage or electrical fields. However, normal
precautions are advised to avoid application
of any voltages higher than maximum rated
voltages
to
this
high-impedance
circuit.
Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage
level (for example, either GND or VCC).
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