EM6617
03/02 REV. C/442
Copyright
2002, EM Microelectronic-Marin SA
65
www.emmicroelectronic.com
23.1 Ordering Information
Note 1:
Please contact EM Microelectronic-Marin S.A. for availability of DIP package.
In the 24 pin version the port C outputs PC[3] and PC[2] are not bonded and therefore not available for the user.
Ordering Part Number
(selected examples)
Part Number
Package/Die Form
Delivery
Form/Thickness
EM6617%%%SO28A
28 pin SOIC
Stick
EM6617%%%SO28B
28 pin SOIC
Tape&Reel
EM6617%%%SO24A
24 pin SOIC
Stick
EM6617%%%SO24B
24 pin SOIC
Tape&Reel
EM6617%%%TP28A
28 pin TSSOP
Stick
EM6617%%%WS11
Sawn wafer
11 mils
EM6617%%%WP11
Die in waffle pack
11 mils
Please make sure to give the complete Part Number when ordering, including the 3-digit version. The version is made of 3
digits %%%: the first one is a letter and the last two are numbers, e.g. P01 , P12, etc.
23.2 Package Marking
DIP and SOIC marking:
TSSOP marking:
First line:
E M 6617
0
% % Y
E M 6
6
1
7 % %
Second line:
P P P PPPPPPP P
P P P P P P P P
Third line:
C C CCCCCC C C C
C C C C C C Y P
Where: %% = last two-digits of the customer-specific number given by EM (e.g. 05, 12, etc.)
Y = Year of assembly
PP…P = Production identification (date & lot number) of EM Microelectronic
CC…C = Customer specific package marking on third line, selected by customer
23.3 Customer Marking
There are 11 digits available for customer marking on PDIP24/28 and SO24/28.
There are 6 digits available for customer marking on TSSOP28.
Please specify below the desired customer marking.
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than
circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves
the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure
that the information given has not been superseded by a more up-to-date version.
Packaged Device:
Device in DIE Form:
Customer Version:
customer-specific number
given by EM Microelectronic
Package:
Die form:
SO24, SO28 = 24/28 pin SOIC
WW = Wafer
TP28 = 28 pin TSSOP
WS = Sawn Wafer/Frame
DL24, DL28 = 24/28 pin DIP (note 1)
WP = Waffle Pack
Thickness:
Delivery Form:
11 = 11 mils (280um), by default
A = Stick
27 = 27 mils (686um), not backlapped
B = Tape&Reel (for SO and TP packages only)
(for other thickness, contact EM)
EM6617 %%% WS 11
EM6617 %%% SO28 B