参数资料
| 型号： | EP3SL340F1760C3N |
| 厂商： | Altera |
| 文件页数： | 2/16页 |
| 文件大小： | 0K |
| 描述： | IC STRATIX III L 340K 1760-FBGA |
| 产品培训模块： | Three Reasons to Use FPGA's in Industrial Designs |
| 标准包装： | 3 |
| 系列： | Stratix® III |
| LAB/CLB数： | 13500 |
| 逻辑元件/单元数： | 337500 |
| RAM 位总计： | 18822144 |
| 输入/输出数： | 1120 |
| 电源电压： | 0.86 V ~ 1.15 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 1760-BBGA，FCBGA |
| 供应商设备封装： | 1760-FCBGA |
1–10
Chapter 1: Stratix III Device Family Overview
Architecture Features
4×, 6×, 7×, 8×, and 10× SERDES modes when using the dedicated DPA circuitry. DPA
minimizes bit errors, simplifies PCB layout and timing management for high-speed
data transfer, and eliminates channel-to-channel and channel-to-clock skew in
high-speed data transmission systems. Soft CDR can also be implemented, enabling
low-cost 1.6-Gbps clock embedded serial links.
Stratix III devices have the following dedicated circuitry for high-speed differential
I/O support:
■
Differential I/O buffer
■
Transmitter serializer
■
Receiver deserializer
■
Data realignment
■
Dynamic phase aligner (DPA)
■
Soft CDR functionality
■
Synchronizer (FIFO buffer)
■
PLLs
f For more information, refer to the High Speed Differential I/O Interfaces with DPA in
Stratix III Devices chapter.
Hot Socketing and Power-On Reset
Stratix III devices are hot-socketing compliant. Hot socketing is also known as hot
plug-in or hot swap, and power sequencing support without the use of any external
devices. Robust on-chip hot-socketing and power-sequencing support ensures proper
device operation independent of the power-up sequence. You can insert or remove a
Stratix III board in a system during system operation without causing undesirable
effects to the running system bus or the board that was inserted into the system.
The hot-socketing feature makes it easier to use Stratix III devices on PCBs that also
contain a mixture of 3.3-V, 3.0-V, 2.5-V, 1.8-V, 1.5-V, and 1.2-V devices. With the
Stratix III hot socketing feature, you do not need to ensure a specific power-up
sequence for each device on the board.
f For more information, refer to the Hot Socketing and Power-On Reset in Stratix III
Devices chapter.
Configuration
Stratix III devices are configured using one of the following four configuration
schemes:
■
Fast passive parallel (FPP)
■
Fast active serial (AS)
■
Passive serial (PS)
■
Joint Test Action Group (JTAG)
All configuration schemes use either an external controller (for example, a MAX II
device or microprocessor), a configuration device, or a download cable.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EP3SL340F1760C3NES | 制造商:Altera Corporation 功能描述:IC FPGA 1120 I/O 1760FBGA 制造商:Altera Corporation 功能描述:IC STRATIX III L FPGA 1760FBGA |
| EP3SL340F1760C4 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP3SL340F1760C4L | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP3SL340F1760C4LN | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP3SL340F1760C4N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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