参数资料
型号: EPF6024AFC256-2
厂商: ALTERA CORP
元件分类: PLD
英文描述: LOADABLE PLD, PBGA256
封装: FINE LINE, BGA-256
文件页数: 33/57页
文件大小: 508K
代理商: EPF6024AFC256-2
Altera Corporation
39
FLEX 6000 Programmable Logic Device Family Data Sheet
Table 20. IOE Timing Microparameters
Symbol
Parameter
Conditions
tOD1
Output buffer and pad delay, slow slew rate = off, VCCIO = VCCINT
C1 = 35 pF (2)
tOD2
Output buffer and pad delay, slow slew rate = off, VCCIO = low voltage
C1 = 35 pF (3)
tOD3
Output buffer and pad delay, slow slew rate = on
C1 = 35 pF (4)
tXZ
Output buffer disable delay
C1 = 5 pF
tZX1
Output buffer enable delay, slow slew rate = off, VCCIO = VCCINT
C1 = 35 pF (2)
tZX2
Output buffer enable delay, slow slew rate = off, VCCIO = low voltage
C1 = 35 pF (3)
tZX3
IOE output buffer enable delay, slow slew rate = on
C1 = 35 pF (4)
tIOE
Output enable control delay
tIN
Input pad and buffer to FastTrack Interconnect delay
tIN_DELAY
Input pad and buffer to FastTrack Interconnect delay with additional delay
turned on
Table 21. Interconnect Timing Microparameters
Symbol
Parameter
Conditions
tLOCAL
LAB local interconnect delay
tROW
Row interconnect routing delay
tCOL
Column interconnect routing delay
tDIN_D
Dedicated input to LE data delay
tDIN_C
Dedicated input to LE control delay
tLEGLOBAL
LE output to LE control via internally-generated global signal delay
tLABCARRY
Routing delay for the carry-out of an LE driving the carry-in signal of a
different LE in a different LAB
tLABCASC
Routing delay for the cascade-out signal of an LE driving the cascade-in
signal of a different LE in a different LAB
Table 22. External Reference Timing Parameters
Symbol
Parameter
Conditions
t1
Register-to-register test pattern
tDRR
Register-to-register delay via 4 LEs, 3 row interconnects, and 4 local
interconnects
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相关代理商/技术参数
参数描述
EPF6024AFC256-2AA 制造商:Rochester Electronics LLC 功能描述:- Bulk
EPF6024AFC256-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF6024AFI256-2 功能描述:IC FLEX 6000 FPGA 24K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:FLEX 6000 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
EPF6024AQC208-1 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF6024AQC208-1N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256