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| 型号： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封装- FBGA封装用户指南。版本4.2 |
| 文件页数： | 73/97页 |
| 文件大小： | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
72
Version 4.2, November 1, 2002
balls. While the N63.2% values are relatively close, the
different slopes tend to amplify the difference between the
two datasets, especially when projected to lower PPM. For
example, if a 1000 PPM criterion is used, the improvement
obtained (of 1.8X) is significantly lower than that shown in
Figure 12 (2.1X). To get an average picture of the whole
data the slopes from the two datasets were pooled to obtain
a common slope of 4.7, and an N63.2% fitted to both
datasets. Now comparing N63.2% values results in an
improvement of 1.13X with the use of larger solder balls.
From this analysis it is seen that even in a best case
scenario for the larger solder balls, the improved lifetime is
still lower than that of the FBGA-BT and MicroBGA
packages.
Figure 12. Field Life Projection
It should also be noted that at 0.45mm, the solder ball size
is quite close to the maximum possible for the solder ball
array with a pitch of 0.8mm, in order to retain sufficient
room to route traces to internal solder balls. Additionally,
the eventual move to a 0.5mm pitch solder ball array
(necessitated by shrinking die sizes due to improved fab
processes, and the need for smaller form factor packages)
will make the use of a 0.45mm ball impossible. The
FBGA-BT package that currently uses 0.3mm solder balls
would be able to transition to a 0.5mm solder ball pitch
without requiring a change in ball size.
(D) Evaluation of Test Vehicles built on 62 mil Boards
All the data discussed in earlier sections was collected on
test boards that were 20mil thick. Testing (0/100 degC
cycling) was also carried out on 62mil (1.6mm) boards to
evaluate the effect of these thicker boards on the solder
joint lifetimes. Figure 13 shows the Weibull plots for the
6x9mm FBGA-PI on both 20mil and 62mil boards. Figure
14 shows similar plots for the 8x9mm FBGA-BT package.
The relevant Weibull parameters are listed in Table 6. It
should be noted here that the FBGA-BT / 62mil board data
presented here is preliminary. This will be updated as
more failures are collected.
It can be seen from Figure 13 that the same challenge of
quantifying the difference (as outlined in the previous
section) exists for these two sets of FBGA-PI data as well.
Using the technique of pooling to a common slope of 7 and
recomputing the N63.2% values, it is found that on an
average, the solder joint life on thinner board exceeds that
on the thicker board by 1.34X for FBGA-PI package. The
slope (beta) for the thicker board was higher than that for
thinner board, and so projections to a low PPM value
showed minimal difference (Figure 15).
For the FBGA-BT package the results are preliminary as
the tests on 62mil boards are still in progress. Initial data
shows minimal difference as the failures obtained so far
have lined up on the existing data on the 20mil boards (see
Figure 14 and preliminary life projections in Figure 15).
It should also be noted that that the 62mil boards were
assembled at a different site. Hence, while these may not
be exact comparisons the information presented is still
useful to demonstrate that there is no significant difference
in the lifetimes projected even when the same packages are
assembled on thicker boards.
Figure 13. FBGA-PI on 20 and 62mil boards
Figure 14. FBGA-BT on 20 and 62mil boards
Table 6. Weibull parameters
6x9 mm FBGA-PI on 20 mil and 62 mil boards
-6.9
-4.6
-2.3
0
2.3
4.6
(100)
6.9
9.2
11.5
Ln(Cycles)
L
6x9 FBGA-PI/20 mil
board
6x9 FBGA-PI/62 mil
board
63.2%
10%
1%
0.1%
99.99%
(10000)
(100000)
(1000)
8x9 mm FBGA-BT on 20 mil and 62 mil boards
-6.9
-4.6
-2.3
0
2.3
6.9
9.2
11.5
Ln(Cycles)
L
8x9 FBGA-BT/20 mil
board
8x9 FBGA-BT/62 mil
board
63.2%
10%
1%
0.1%
99.99%
(10000)
(100000)
(1000)
-15C / 25C, 1 cyc/day
Comparison of packagesat 100 PPM cume fail
0
10
20
30
40
8x9mm FBGA-PI, 0.4 mm
ball
8x9mm FBGA-PI, 0.45 mm
ball
P
Package
N63.2 (cyc)
Beta
# fails / SS
6x9 mm FBGA-PI, 20mil board
6x9 mm FBGA-PI, 62mil board
8x9 mm FBGA-BT, 20mil board
8x9 mm FBGA-BT, 62mil board
2685
1932
11586
11757
6.0
7.9
5.0
5.2
38 / 60
45 / 48
39 / 48
5 / 30
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相关代理商/技术参数 |
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| FBGA96T.5-DC144 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:FBGA96T.5-DC144 |
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| FBGC-1.44G | 制造商:MERRIMAC 制造商全称:MERRIMAC 功能描述:FILTER |
| FBGC-2.75G | 制造商:MERRIMAC 制造商全称:MERRIMAC 功能描述:FILTER |
| FBGC-3-1.4G | 制造商:MERRIMAC 制造商全称:MERRIMAC 功能描述:FILTER |
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