- 您现在的位置：买卖IC网 > PDF目录370153 > FBGA FBGA - FBGA User＇s Guide. Version 4.2 PDF资料下载
参数资料
| 型号： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封装- FBGA封装用户指南。版本4.2 |
| 文件页数： | 82/97页 |
| 文件大小： | 2624K |
| 代理商： | FBGA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页当前第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页
FBGA User’s Guide
Version 4.2, November 1, 2002
81
4
provide a more meaningful method to predict junction temperature in plastic packaged
devices, the parameter
Ψ
J-T
was created. An excerpt from the EIA/JESD51-2 standard
follows describing the method and use of
Ψ
J-T
.
4.0 THERMAL CHARACTERIZATION PARAMETER
-
Ψ
JT
JUNCTION-TO-TOP CENTER OF PACKAGE
The thermal characterization parameter,
Ψ
JT
,
is proportional to the temperature difference between the top
center of the package and the junction temperature. Hence, it is a useful value for an engineer verifying
device temperatures in an actual environment. By measuring the package temperature of the device, the
junction temperature can be estimated if the thermal characterization parameter has been measured under
similar conditions.
The use of
Ψ
JT
should not be confused with
θ
JC
which is the thermal resistance from the device junction to the
external surface of the package or case nearest the die attachment as the case is held at a constant
temperature. The use and reporting of the case temperature during the junction to ambient thermal
resistance test is optional.
The measurement may be made using a temperature transducer such as a thermocouple, fluoroptic sensor,
or infrared sensor.
4.1 THERMOCOUPLE PLACEMENT LOCATION
The thermocouple bead shall be attached to the package at the geometric center of the top surface. The
position must be reported, in all cases, along with the measurement data.
4.2 PACKAGE THERMOCOUPLE APPLICATION
CAUTION: Usefulness of this measurement is dependent on the procedure.
Application of the thermocouple is critical to ensure proper thermal contact to the package and to ensure
that the
θ
JA
measurement is not disturbed. Determination of the package surface temperature, of a low
conductance package body, requires that the following factors be considered:
4.2.1 The thermocouple wire and bead shall touch the surface of the package.
4.2.2 Best practice for attaching the wire and thermocouple bead is the use of a minimal amount of
thermally conducting epoxy. The distance across the epoxy bead shall not exceed .1” (2.54 mm) in
any direction.
4.2.3 The thermocouple wire shall be routed next to the package body down to the board and along
the board. This reduces cooling of the thermocouple junction by heat flowing along the wire.
4.2.4 Thermocouple wire size shall be small such that heat loss along the wire does not cause
anomalous low readings. Recommended maximum thermocouple sizes is 36 gauge. For type T
thermocouples, 40 gauge is preferred.
4.3 PROCEDURE
The junction temperature and package temperatures are determined at the steady-state condition in the
measurement as specified above. The junction-to-top center of package thermal characterization
parameter,
Ψ
JT
, is calculated using the following equation:
θ
相关PDF资料 |
PDF描述 |
|---|---|
| FBI1.5A4S1 | Bridge Rectifiers (In Line) |
| FBI1.5B4S1 | Bridge Rectifiers (In Line) |
| FBI1.5B5S2 | Bridge Rectifiers (In Line) |
| FBI1.5D4S1 | Bridge Rectifiers (In Line) |
| FBI1.5D5S2 | Bridge Rectifiers (In Line) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| FBGA96T.5-DC144 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:FBGA96T.5-DC144 |
| FBGA-SD | 制造商:STATSCHIP 制造商全称:STATSCHIP 功能描述:Fine Pitch Ball Grid Array - Stacked Die |
| FBGC-1.44G | 制造商:MERRIMAC 制造商全称:MERRIMAC 功能描述:FILTER |
| FBGC-2.75G | 制造商:MERRIMAC 制造商全称:MERRIMAC 功能描述:FILTER |
| FBGC-3-1.4G | 制造商:MERRIMAC 制造商全称:MERRIMAC 功能描述:FILTER |
发布紧急采购，3分钟左右您将得到回复。