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| 型号： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封装- FBGA封装用户指南。版本4.2 |
| 文件页数： | 74/97页 |
| 文件大小： | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
Version 4.2, November 1, 2002
73
Figure 15. Evaluation on 62mil boards
(E) Temperature Cycling at -40 / 1degC
A limited amount of data was also collected at the -40/100
degC, 30 minute cycle test condition on 20mil boards.
Table 7 is a summary of that data. The 8x9mm FBGA-BT
and the 8x9mm FBGA-PI packages were evaluated. The
test was terminated at 2507 cycles. At that point, there
were zero fails (0/60) of the FBGA-BT test vehicles and
extensive failures (49/60) in the FBGA-PI test vehicles.
While no field projections are included here, this
information again gives an indication of the relative
robustness of the two packages.
Table 7. Board Level Reliability Data at –40/degC
test condition
CONCLUSIONS
(i)
In the packages evaluated, the FBGA-BT and
MicroBGA demonstrated lifetimes considerably higher
than the FBGA-PI and FBGA-Ceramic packages.
These differences in board level reliability can be
explained by the differences in package construction
and material sets.
(ii)
In the FBGA-PI package, the larger 8x9mm package
for the higher density 16Mb device (larger Silicon die)
demonstrated lower reliability than the 6x9mm
package for the 8Mb device. Based on this trend, it
was anticipated that even larger packages (for
32/64Mb) would show lower solder joint lifetimes in
the FBGA-PI construction.
(iii)
The use of the larger solder balls (0.45mm vs. 0.4mm)
on the FBGA-PI package resulted in an improved
solder joint fatigue life. Even in the best case scenario
for the larger solder balls, the improved lifetime was
Table 7. Board Level Reliability Data at –40/100
still lower than that of FBGA-BT and MicroBGA
packages. Feasibility of using a 0.45mm ball size
would be challenged as migration to 0.5mm ball pitch
is made.
(iv)
At 100 PPM no significant difference in the board level
reliability was detected for both the FBGA-BT and
FBGA-PI packages assembled on the thicker 62mil
boards when compared to those mounted on the 20mil
boards.
(v)
Limited data at the -40/100 degC test condition
indicates the relative robustness of FBGA-BT over
FBGA-PI with respect to board level reliability, that is
consistent with the rest of the 0/100 degC data
discussed in this paper.
ACKNOWLEDGMENT
The authors would like to acknowledge Melissa Lee, John
Hunter, Bruce Schupp, James Hayward, and Ed Fontecha
for their guidance and support, Dave Morken for the SEM
analysis and Robert Dudero for cross-sectioning of the
samples.
REFERENCES
[1] K. Norris and A. Landzberg, IBM Journal of Research
and Dev, 13, pp 266, 1969.
[2] K. Ano, et al, “Reliability study of the chip scale
package using flex substrate”, SMI Proc, pp44-47, 1997.
[3] R. Darveaux, J. Heckman, A. Mawer, “Effect of test
board design on the 2
nd
level reliability of a fine pitch BGA
package”, Proc of SMI, pp 105-111, 1998.
[4] C.F. Coombs Jr., “Printed Circuits Handbook”,
McGraw Hill, NY, 1995.
Comparison at 100 PPM cume fa
-15C / 25C, 1 cyc/day
Effect of Board Thickness
0
25
50
75
100
6x9 FBGA-PI,
20mil board
6x9 FBGA-PI,
62mil board
8x9 FBGA-BT,
20mil board
8x9 FBGA-BT,
62mil board
P
Test Condition: -40 / 100 degC
8x9 FBGA-BT
8x9 FBGA-PI
Cycles completed
Data
2507
No fails
out of 60
2507
49 fail
out of 60
First fail at:
n/a
754
Test status
Stopped
Stopped
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