参数资料
型号: FDB039N06
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 60V 120A D2PAK
产品目录绘图: D2PAK, TO-263AB Pkg
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 120A
开态Rds(最大)@ Id, Vgs @ 25° C: 3.9 毫欧 @ 75A,10V
Id 时的 Vgs(th)(最大): 4.5V @ 250µA
闸电荷(Qg) @ Vgs: 133nC @ 10V
输入电容 (Ciss) @ Vds: 8235pF @ 25V
功率 - 最大: 231W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D²PAK
包装: 标准包装
产品目录页面: 1606 (CN2011-ZH PDF)
其它名称: FDB039N06DKR
March 2013
FDB039N06
N-Channel PowerTrench ? MOSFET
60 V, 174 A, 3.9 m Ω
Features
? R DS(on) = 2.95 m Ω ( Typ.) @ V GS = 10 V, I D = 75 A
? Fast Switching Speed
? Low Gate Charge
? High Performance Trench Technology for Extremely Low
R DS(on)
? High Power and Current Handling Capability
? RoHS Compliant
D
D 2 -PAK
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor ? ’s advanced PowerTrench ? process that has
been tailored to minimize the on-state resistance while maintain-
ing superior switching performance.
Applications
? Synchronous Rectification for ATX / Server / Telecom PSU
? Battery Protection Circuit
? Motor drives and Uninterruptible Power Supplies
? Renewable system
D
G
G
S
S
MOSFET Maximum Ratings T C = 25 o C unless otherwise noted
Symbol
V DSS
V GSS
Drain to Source Voltage
Gate to Source Voltage
Parameter
-Continuous (T C = 25 o C, Silicion Limited)
FDB039N06
60
±20
174*
Unit
V
V
I D
Drain Current
-Continuous (T C = 100 o C, Silicion Limited)
123*
A
-Continuous (T C = 25 o C, Package Limited)
120
I DM
Drain Current
- Pulsed
(Note 1)
696
A
E AS
dv/dt
P D
Single Pulsed Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(T C = 25 o C)
- Derate above 25 o C
(Note 2)
(Note 3)
872
7.0
231
1.54
mJ
V/ns
W
W/ o C
T J , T STG
T L
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
-55 to +175
300
o
o
C
C
* Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 120A.
Thermal Characteristics
Symbol
R θ JC
Parameter
Thermal Resistance, Junction to Case, Max.
FDB039N06
0.65
Unit
Thermal Resistance, Junction to Ambient (1 in pad of 2 oz copper), Max.
R θ JA
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max.
2
62.5
40
o
C/W
?2009 Fairchild Semiconductor Corporation
FDB039N06 Rev. C1
1
www.fairchildsemi.com
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