参数资料
型号: FDC658AP
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET P-CH SGL LL 30V 4A SSOT6
产品变化通告: Design/Process Change 11/May/2007
Mold Compound Change 08/April/2008
产品目录绘图: MOSFET SuperSOT-6
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 4A
开态Rds(最大)@ Id, Vgs @ 25° C: 50 毫欧 @ 4A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 8.1nC @ 5V
输入电容 (Ciss) @ Vds: 470pF @ 15V
功率 - 最大: 800mW
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: 6-SOT
包装: 标准包装
产品目录页面: 1603 (CN2011-ZH PDF)
其它名称: FDC658APDKR
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
' BV DSS
' T J
I DSS
I GSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage
I D = -250 P A, V GS = 0V
I D = -250 P A,
Referenced to 25°C
V GS = 0V, V DS = -24V
V GS = r 25V, V DS = 0V
-30
-22
-1
r 100
V
mV/°C
P A
nA
On Characteristics (Note 2)
V GS(TH)
' V GS(TH )
' T J
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
V DS = V GS , I D = -250 P A
I D = -250 P A,
Referenced to 25°C
-1
-1.8
4
-3
V
mV/°C
I D = -4A, V GS = -10V
44
50
r DS(on)
I D(ON)
g FS
Static Drain-Source On-Resistance
On-State Drain Current
Forward Transconductance
I D = -3.4A, V GS = -4.5V
I D = -4A, V GS = -10V,
T J = 125°C
V GS = -10V, V DS = -5V
I D = -4A, V DS = -5V
-20
67
60
8.4
75
70
m :
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = -15V, V GS = 0V,
f = 1MHz
470
126
61
pF
pF
pF
Switching Characteristics (Note 2)
t d(on)
Turn-On Delay Time
7
14
ns
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = -15V, I D = -1A
V GS = -10V, R GEN = 6 :
V DS = -15V, I D = -4A,
V GS = -5V
12
16
6
6
2.1
2
22
29
12
8.1
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain-Source Diode Forward Current
-1.3
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0V, I S = -1.3 A (Note 2)
-0.77
-1.2
V
Notes:
1: R T JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R T JC is guaranteed by design while R T CA is determined by the user's board design.
a) 78 o C/W when mounted on a
1 in 2 pad of 2 oz copper
Scale 1: 1 on letter size paper
2: Pulse Test: Pulse Width < 300 P s, Duty Cycle < 2.0%
FDC658AP Rev. B 1
2
b) 156 o C/W whe mounted on a
minimum pad of 2 oz copper
www.fairchildsemi.com
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