参数资料
型号: FDC658AP
厂商: Fairchild Semiconductor
文件页数: 4/5页
文件大小: 0K
描述: MOSFET P-CH SGL LL 30V 4A SSOT6
产品变化通告: Design/Process Change 11/May/2007
Mold Compound Change 08/April/2008
产品目录绘图: MOSFET SuperSOT-6
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 4A
开态Rds(最大)@ Id, Vgs @ 25° C: 50 毫欧 @ 4A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 8.1nC @ 5V
输入电容 (Ciss) @ Vds: 470pF @ 15V
功率 - 最大: 800mW
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: 6-SOT
包装: 标准包装
产品目录页面: 1603 (CN2011-ZH PDF)
其它名称: FDC658APDKR
Typical Characteristics
10
600
I D = -4A
V DS = -5V
-10V
C iss
f = 1 MHz
V GS = 0 V
8
-15V
450
6
300
4
2
150
C rss
C oss
0
0
0
2
4
6
8
10
0
6
12
18
24
30
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics
100
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance vs Drain to Source Voltage
10
SINGLE PULSE
10
r DS(on) LIMIT
100us
8
R JA = 156°C/W
T A = 25°C
1ms
6
1
10ms
V GS = -10V
100ms
4
0.1
SINGLE PULSE
R JA = 156 o C/W
1s
2
T A = 25 C
0.01
o
DC
0
0.1
1
10
100
0.01
0.1
1
10
100
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 9. Forward Bias Safe Operating Area
t, PULSE WIDTH (s)
Figure 10. Single Pulse Maximum Power
Dissipation
1
R JA = 156 C/W
D = 0.5
0.2
R JA (t) = r(t) x R JA
o
0.1
0.1
0.05
0.02
P(pk)
t 1
0.01
0.001
0.01
SINGLE PULSE
t 2
T J - T A = P x R JA (t)
Duty Cycle, D = t 1 / t 2
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t, RECTANGULAR PULSE DURATION
Figure 11. Transient Thermal Response Curve
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDC658AP Rev. B 1
4
www.fairchildsemi.com
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