参数资料
型号: FDG330P
厂商: Fairchild Semiconductor
文件页数: 4/5页
文件大小: 0K
描述: MOSFET P-CH 12V 2A SC70-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
标准包装: 3,000
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 12V
电流 - 连续漏极(Id) @ 25° C: 2A
开态Rds(最大)@ Id, Vgs @ 25° C: 110 毫欧 @ 2A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 7nC @ 4.5V
输入电容 (Ciss) @ Vds: 477pF @ 6V
功率 - 最大: 480mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 带卷 (TR)
Typical Characteristics
6
800
5
4
I D = -2A
V DS = -4V
-8V
-6V
700
600
C ISS
f = 1 MHz
V GS = 0 V
500
3
400
2
300
C OSS
200
1
0
0
2
4
6
8
100
0
0
2
4
C RSS
6
8
10
12
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
100
10
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
SINGLE PULSE
10
R DS(ON) LIMIT
100 μ s
8
R θ JA = 260°C/W
T A = 25°C
1ms
1
100ms
1s
10ms
6
0.1
V GS = -4.5V
SINGLE PULSE
R θ JA = 260 o C/W
DC
4
2
T A = 25 o C
0.01
0.1
1
10
100
0
0.01
0.1
1
10
100
-V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area.
t 1 , TIME (sec)
Figure 10. Single Pulse Maximum
Power Dissipation.
1
R θ JA = 260 C/W
D = 0.5
0.2
R θ JA (t) = r(t) * R θ JA
o
0.1
0.1
0.05
0.02
P(pk)
t 1
0.01
0.01
t 2
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 / t 2
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t 1 , TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDG330P Rev D (W)
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