参数资料
型号: FDG332PZ
厂商: Fairchild Semiconductor
文件页数: 4/6页
文件大小: 0K
描述: MOSFET P-CH 20V 2.6A SC70-6
产品变化通告: Mold Compound Change 12/Dec/2007
产品目录绘图: MOSFET SC70-6 Pkg
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 95 毫欧 @ 2.6A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 10.8nC @ 4.5V
输入电容 (Ciss) @ Vds: 560pF @ 10V
功率 - 最大: 480mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 标准包装
产品目录页面: 1608 (CN2011-ZH PDF)
其它名称: FDG332PZDKR
Typical Characteristics T J = 25°C unless otherwise noted
4.5
3.0
1.5
I D = -2.6A
V DD = -5V
V DD = -10V
V DD = -15V
1000
100
C iss
C oss
f = 1MHz
V GS = 0V
C rss
0.0
0
2
4
6
8
30
0.1
1
10
20
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance vs Drain
to Source Voltage
10
10
10
100us
5
4
V GS = 0V
10
3
10
10
10
10
R
JA = 260 C/W
10
10
1
0.1
THIS AREA IS
LIMITED BY r DS(on)
SINGLE PULSE
T J = MAX RATED
o
T A = 25 o C
1ms
10ms
100ms
1s
10s
DC
2
1
0
-1
-2
-3
T J = 150 o C
T J = 25 o C
10
0.01
0.1
1
10
50
-4
0
5
10
15
20
100
10
-V DS , DRAIN to SOURCE VOLTAGE (V)
Figure 9. Forward Bias Safe
Operating Area
V GS = -4.5V
-V GS, GATE TO SOURCE VOLTAGE (V)
Figure 10. Gate Leakage Current vs Gate to
Source Voltage
SINGLE PULSE
JA = 260 C/W
R
o
T A = 25 C
o
1
10
10
10
10
10
10
10
0.1
-3
-2
-1
0
1
2
3
t, PULSE WIDTH (s)
Figure 11.
Transient Thermal Response Curve
?2008 Fairchild Semiconductor Corporation
FDG332PZ Rev.B1
4
www.fairchildsemi.com
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