参数资料
型号: FDG6304P_D87Z
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET P-CH DUAL 25V SC70-6
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
Product Discontinuation 03/Dec/2009
标准包装: 10,000
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 410mA
开态Rds(最大)@ Id, Vgs @ 25° C: 1.1 欧姆 @ 410mA,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 1.5nC @ 4.5V
输入电容 (Ciss) @ Vds: 62pF @ 10V
功率 - 最大: 300mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 带卷 (TR)
Electrical Characteristics (T A = 25 O C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BV DSS
? BV DSS / ? T J
I DSS
I GSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Zero Gate Voltage Drain Current
Gate - Body Leakage Current
V GS = 0 V, I D = -250 μA
I D = -250 μA, Referenced to 25 o C
V DS = -20 V, V GS = 0 V
T J = 55°C
V GS = -8 V, V DS = 0 V
-25
-22
-1
-10
-100
V
mV / o C
μA
μA
nA
ON CHARACTERISTICS (Note 2)
V GS(th)
? V GS(th) / ? T J
R DS(ON)
Gate Threshold Voltage
Gate Threshold Voltage Temp.Coefficient
Static Drain-Source On-Resistance
V DS = V GS , I D = -250 μA
I D = -250 μA, Referenced to 25 o C
V GS = -4.5 V, I D = -0.41 A
-0.65
-0.82
2
0.85
-1.5
1.1
V
mV / o C
?
V GS = -2.7 V, I D = -0.25 A
T J =125°C
1.2
1.15
1.9
1.5
I D(ON)
g FS
On-State Drain Current
Forward Transconductance
V GS = -4.5 V, V DS = -5 V
V DS = -5 V, I D = -0.41 A
-1.5
0.9
A
S
DYNAMIC CHARACTERISTICS
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 10 V, V GS = 0 V,
f = 1.0 MHz
62
34
10
pF
pF
pF
SWITCHING CHARACTERISTICS (Note 2)
t D(on)
t r
t D(off)
t f
Q g
Q gs
Q gd
Turn - On Delay Time
Turn - On Rise Time
Turn - Off Delay Time
Turn - Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = -5 V, I D = -0.5 A,
V GS = -4.5 V, R GEN = 6 ?
V DS = -5 V, I D = -0.41 A,
V GS = -4.5 V
7
8
55
35
1.1
0.31
0.29
15
16
80
60
1.5
ns
ns
ns
ns
nC
nC
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I S
Maximum Continuous Source Current
-0.25
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = -0.25 A (Note 2)
-0.85
-1.2
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θ JC is guaranteed
by design while R θ CA is determined by the user's board design. R θ JA = 415 O C/W on minimum pad mounting on FR-4 board in still air.
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
FDG6304P Rev.E1
相关PDF资料
PDF描述
FDG6306P MOSF P CH DUAL 20V 600MA SC70-6
FDG6308P MOSFET P-CH DUAL 20V SC70-6
FDG6316P MOSF P CH DUAL 12V 700MA SC70-6
FDG6317NZ MOSFET N-CH DUAL 20V SC70-6
FDG6318PZ MOSFET P-CH DUAL 20V SC70-6
相关代理商/技术参数
参数描述
FDG6306P 功能描述:MOSFET P-Ch PowerTrench Specified 2.5V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
FDG6306P_D87Z 功能描述:MOSFET RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
FDG6306P_Q 功能描述:MOSFET P-Ch PowerTrench Specified 2.5V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
FDG6308 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:P-Channel 1.8V Specified PowerTrench MOSFET
FDG6308P 功能描述:MOSFET Dual P-Ch 1.8V Spec Power Trench RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube