参数资料
型号: FDG6306P
厂商: Fairchild Semiconductor
文件页数: 3/5页
文件大小: 0K
描述: MOSF P CH DUAL 20V 600MA SC70-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
产品目录绘图: MOSFET SC70-6 Pkg
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 600mA
开态Rds(最大)@ Id, Vgs @ 25° C: 420 毫欧 @ 600mA,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 2nC @ 4.5V
输入电容 (Ciss) @ Vds: 114pF @ 10V
功率 - 最大: 300mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 标准包装
产品目录页面: 1608 (CN2011-ZH PDF)
其它名称: FDG6306PDKR
Typical Characteristics
2
2.5
1.6
V GS = -4.5V
-3.5V
-3.0V
-2.5V
2.25
2
1.2
0.8
1.75
1.5
V GS = -2.5V
-3.0V
0.4
-2.0V
1.25
1
-3.5V
-4.0V
-4.5V
0
0.75
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
-V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 1. On-Region Characteristics.
1.4
I D = -0.6A
1.2
-I D , DRAIN CURRENT (A)
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
I D = -0.3 A
1.3
1.2
1.1
V GS = -4.5V
1
0.8
T A = 25 C
1
0.9
0.8
0.6
0.4
o
o
T A = 125 C
0.7
-50
-25
0
25
50
75
100
125
150
0.2
1.5
2
2.5
3
3.5
4
4.5
5
T J , JUNCTION TEMPERATURE ( C)
o
Figure 3. On-Resistance Variation with
Temperature.
-V GS , GATE TO SOURCE VOLTAGE (V)
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
T A = -55 C
2
V D S = -5V
o
o
25 C
10
V GS = 0V
T A = 125 C
1.5
o
125 C
1
0.1
o
25 C
-55 C
1
0.01
o
o
0.5
0.001
0
0.5
1
1.5
2
2.5
3
0.0001
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-V GS , GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics.
-V SD , BODY DIODE FORWARD VOLTAGE (V)
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
FDG6306P Rev C (W)
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