参数资料
型号: FDMA3023PZ
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH DUAL 30V MICROFET6
产品目录绘图: MicorFET 2x2, SC-75 Dual
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2.9A
开态Rds(最大)@ Id, Vgs @ 25° C: 90 毫欧 @ 2.9A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 11nC @ 4.5V
输入电容 (Ciss) @ Vds: 530pF @ 15V
功率 - 最大: 700mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-MicroFET(2x2)
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDMA3023PZDKR
January 2013
FDMA3023PZ
Dual P-Channel PowerTrench ? MOSFET
-30 V, -2.9 A, 90 m Ω
Features
Max r DS(on) = 90 m Ω at V GS = -4.5 V, I D = -2.9 A
Max r DS(on) = 130 m Ω at V GS = -2.5 V, I D = -2.6 A
Max r DS(on) = 170 m Ω at V GS = -1.8 V, I D = -1.7 A
Max r DS(on) = 240 m Ω at V GS = -1.5 V, I D = -1.0 A
Low profile - 0.8 mm maximum - in the new package MicroFET
2x2 mm
HBM ESD protection level > 2 kV (Note 3)
RoHS Compliant
Free from halogenated compounds and antimony
oxides
PIN 1
General Description
This device is designed specifically as a single package solution
for the battery charge switch in cellular handset and other
ultra-portable applications. It features two independent
P-Channel MOSFETs with low on-state resistance for minimum
conduction losses. When connected in the typical common
source configuration, bi-directional current flow is possible.
The MicroFET 2X2 package offers exceptional thermal
performance for its physical size and is well suited to linear mode
applications.
S1
G1
D2
2
D1
D2
S1
G1
1 1
2
6 6
5 5
D1
G2
3
4
D1
G2 S2
D2
3
4
S2
MicroFET 2x2
MOSFET Maximum Ratings T A = 25 °C unless otherwise noted
Symbol
V DS
V GS
Drain to Source Voltage
Gate to Source Voltage
Parameter
Ratings
-30
±8
Units
V
V
I D
P D
T J , T STG
Drain Current -Continuous
-Pulsed
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
(Note 1a)
(Note 1a)
(Note 1b)
-2.9
-6
1.4
0.7
-55 to +150
A
W
°C
Thermal Characteristics
R θ JA
Thermal Resistance for Single Operation, Junction to Ambient
(Note 1a)
86
R θ JA
R θ JA
R θ JA
Thermal Resistance for Single Operation, Junction to Ambient
Thermal Resistance for Dual Operation, Junction to Ambient
Thermal Resistance for Dual Operation, Junction to Ambient
(Note 1b)
(Note 1c)
(Note 1d)
173
69
151
°C/W
Package Marking and Ordering Information
Device Marking
323
Device
FDMA3023PZ
Package
MicroFET 2X2
Reel Size
7 ’’
Tape Width
8 mm
Quantity
3000 units
?2013 Fairchild Semiconductor Corporation
FDMA3023PZ Rev.C
1
www.fairchildsemi.com
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