参数资料
型号: FDMC2514SDC
厂商: Fairchild Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 25V 40A POWER33
标准包装: 1
系列: Dual Cool™, PowerTrench®, SyncFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 24A
开态Rds(最大)@ Id, Vgs @ 25° C: 3.5 毫欧 @ 22.5A,10V
Id 时的 Vgs(th)(最大): 3V @ 1mA
闸电荷(Qg) @ Vgs: 44nC @ 10V
输入电容 (Ciss) @ Vds: 2705pF @ 13V
功率 - 最大: 3W
安装类型: 表面贴装
封装/外壳: 8-PowerVDFN
供应商设备封装: *
包装: 标准包装
其它名称: FDMC2514SDCDKR
October 2010
FDMC2514SDC
N-Channel Dual Cool TM PowerTrench ? SyncFET TM
25 V, 40 A, 3.5 m Ω
Features
General Description
Dual Cool TM Top Side Cooling PQFN package
This N-Channel MOSFET is
produced using Fairchild
Max r DS(on) = 3.5 m Ω at V GS = 10 V, I D = 22.5 A
Max r DS(on) = 4.7 m Ω at V GS = 4.5 V, I D = 18 A
High performance technology for extremely low r DS(on)
SyncFET Schottky Body Diode
RoHS Compliant
Semiconductor’s advanced PowerTrench ? process.
Advancements in both silicon and Dual Cool TM package
technologies have been combined to offer the lowest r DS(on)
while maintaining excellent switching performance by extremely
low Junction-to-Ambient thermal resistance. This device has the
added benefit of an efficient monolithic Schottky body diode.
Applications
Synchronous Rectifier for DC/DC Converters
Telecom Secondary Side Rectification
High End Server/Workstation Vcore Low Side
Pin 1
S
S
S
G
D
5
4 G
D
6
3
S
D
D
D
D
D
D
7
8
2 S
1 S
Top
Power 33
Bottom
MOSFET Maximum Ratings T A = 25°C unless otherwise noted
Symbol
V DS
Drain to Source Voltage
Parameter
Ratings
25
Units
V
V GS
Gate to Source Voltage
Drain Current -Continuous (Package limited)
T C = 25 °C
(Note 4)
±20
40
V
I D
-Continuous (Silicon limited)
-Continuous
T C = 25 °C
T A = 25 °C
(Note 1a)
106
24
A
-Pulsed
200
E AS
dv/dt
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
(Note 3)
(Note 5)
84
2.0
mJ
V/ns
P D
Power Dissipation
Power Dissipation
T C = 25 °C
T A = 25 °C
(Note 1a)
60
3.0
W
T J , T STG
Operating and Storage Junction Temperature Range
-55 to +150
°C
Thermal Characteristics
R θ JC
R θ JC
R θ JA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
(Top Source)
(Bottom Drain)
(Note 1a)
5.8
2.1
42
R θ JA
R θ JA
R θ JA
R θ JA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1b)
(Note 1i)
(Note 1j)
(Note 1k)
105
17
26
12
°C/W
Package Marking and Ordering Information
Device Marking
2514S
Device
FDMC2514SDC
Package
Dual Cool TM Power 33
Reel Size
13’’
Tape Width
12 mm
Quantity
3000 units
?2010 Fairchild Semiconductor Corporation
FDMC2514SDC Rev.C2
1
www.fairchildsemi.com
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