参数资料
型号: FDMS3006SDC
厂商: Fairchild Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 30V 34A 8-PQFN
标准包装: 3,000
系列: Dual Cool™, PowerTrench®, SyncFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 34A
开态Rds(最大)@ Id, Vgs @ 25° C: 1.9 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 3V @ 1mA
闸电荷(Qg) @ Vgs: 80nC @ 10V
输入电容 (Ciss) @ Vds: 5725pF @ 15V
功率 - 最大: 3.3W
安装类型: 表面贴装
封装/外壳: 8-PowerTDFN
供应商设备封装: Power56
包装: 带卷 (TR)
July 2013
FDMS3006SDC
N-Channel Dual Cool TM PowerTrench ? SyncFET TM
30 V, 90 A, 1.9 m Ω
Features
Dual Cool TM Top Side Cooling PQFN package
Max r DS(on) = 1.9 m Ω at V GS = 10 V, I D = 30 A
Max r DS(on) = 2.7 m Ω at V GS = 4.5 V, I D = 26 A
High performance technology for extremely low r DS(on)
SyncFET Schottky Body Diode
RoHS Compliant
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advanced PowerTrench ? process.
Advancements in both silicon and Dual Cool TM package
technologies have been combined to offer the lowest r DS(on)
while maintaining excellent switching performance by extremely
low Junction-to-Ambient thermal resistance. This device has the
added benefit of an efficient monolithic Schottky body diode.
Applications
Synchronous Rectifier for DC/DC Converters
Telecom Secondary Side Rectification
High End Server/Workstation Vcore Low Side
D
D
Pin 1
D
D
S
S
S
G
S
S
S
G
D
D
D
D
Top
Power 56
Bottom
MOSFET Maximum Ratings T A = 25°C unless otherwise noted
Symbol
V DS
Drain to Source Voltage
Parameter
Ratings
30
Units
V
V GS
Gate to Source Voltage
Drain Current -Continuous (Package limited)
T C = 25 °C
(Note 4)
±20
90
V
I D
-Continuous (Silicon limited)
-Continuous
T C = 25 °C
T A = 25 °C
(Note 1a)
179
34
A
-Pulsed
200
E AS
dv/dt
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
(Note 3)
(Note 5)
144
1.8
mJ
V/ns
P D
Power Dissipation
Power Dissipation
T C = 25 °C
T A = 25 °C
(Note 1a)
89
3.3
W
T J , T STG
Operating and Storage Junction Temperature Range
-55 to +150
°C
Thermal Characteristics
R θ JC
R θ JC
R θ JA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
(Top Source)
(Bottom Drain)
(Note 1a)
2.7
1.4
38
R θ JA
R θ JA
R θ JA
R θ JA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1b)
(Note 1i)
(Note 1j)
(Note 1k)
81
16
23
11
°C/W
Package Marking and Ordering Information
Device Marking
3006S
Device
FDMS3006SDC
Package
Dual Cool TM Power 56
Reel Size
13’’
Tape Width
12 mm
Quantity
3000 units
?2012 Fairchild Semiconductor Corporation
FDMS3006SDC Rev.C4
1
www.fairchildsemi.com
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