参数资料
型号: FDN357N
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 30V 1.9A SSOT3
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 08/April/2008
产品目录绘图: SuperSOT-3, SOT-23
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 1.9A
开态Rds(最大)@ Id, Vgs @ 25° C: 60 毫欧 @ 2.2A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 5.9nC @ 5V
输入电容 (Ciss) @ Vds: 235pF @ 10V
功率 - 最大: 460mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: 3-SSOT
包装: 标准包装
产品目录页面: 1602 (CN2011-ZH PDF)
其它名称: FDN357NDKR
Electrical Characteristics (T A = 25 O C unless otherwise noted )
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BV DSS
? BV DSS / ? T J
I DSS
I GSSF
I GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Zero Gate Voltage Drain Current
Gate - Body Leakage, Forward
Gate - Body Leakage, Reverse
V GS = 0 V, I D = 250 μA
I D = 250 μA, Referenced to 25 o C
V DS = 24 V, V GS = 0 V
T J = 55°C
V GS = 20 V,V DS = 0 V
V GS = -20 V, V DS = 0 V
30
36
1
10
100
-100
V
mV/ o C
μA
μA
nA
nA
ON CHARACTERISTICS
(Note)
V GS(th)
? V GS(th) / ? T J
R DS(ON)
Gate Threshold Voltage
Gate Threshold Voltage Temp. Coefficient
Static Drain-Source On-Resistance
V DS = V GS , I D = 250 μA
I D = 250 μA, Referenced to 25 o C
V GS = 4.5 V, I D = 1.9 A
1
1.6
-3.6
0.081
2
0.09
V
mV/ o C
?
V GS = 10 V, I D = 2.2 A
T J =125°C
0.11
0.053
0.14
0.06
I D(ON)
g FS
On-State Drain Current
Forward Transconductance
V GS = 4.5 V, V DS = 5 V
V DS = 5 V, I D = 1.9 A
5
5
A
S
DYNAMIC CHARACTERISTICS
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 10 V, V GS = 0 V,
f = 1.0 MHz
235
145
50
pF
pF
pF
SWITCHING CHARACTERISTICS
(Note)
t D(on)
t r
t D(off)
t f
Q g
Q gs
Q gd
Turn - On Delay Time
Turn - On Rise Time
Turn - Off Delay Time
Turn - Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 10 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V DS = 10 V, I D = 1.9 A,
V GS = 5 V
5
12
12
3
4.2
1.3
1.7
10
22
22
8
5.9
ns
ns
ns
ns
nC
nC
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I S
Maximum Continuous Drain-Source Diode Forward Current
0.42
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = 0.42 A
(Note)
0.71
1.2
V
Note:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θ JC is guaranteed by
design while R θ CA is determined by the user's board design.
Typical R θ JA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment :
a. 250 o C/W when mounted on
a 0.02 in 2 pad of 2oz Cu.
b. 270 o C/W when mounted on
a 0.001 in 2 pad of 2oz Cu.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
FDN357N Rev.C
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