参数资料
型号: FDN372S
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 30V 2.6A SSOT-3
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Wire Bonding Change 07/Nov/2008
Mold Compound Change 08/April/2008
Product Discontinuation 27/Feb/2012
标准包装: 3,000
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 40 毫欧 @ 2.6A,10V
Id 时的 Vgs(th)(最大): 3V @ 1mA
闸电荷(Qg) @ Vgs: 8.1nC @ 5V
输入电容 (Ciss) @ Vds: 630pF @ 15V
功率 - 最大: 460mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: 3-SSOT
包装: 带卷 (TR)
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage
V GS = 0 V,
I D = 1 mA
30
V
? BV DSS
? T J
Breakdown Voltage Temperature
Coefficient
I D = 10 mA, Referenced to 25 ° C
24
mV/ ° C
I DSS
I GSS
Zero Gate Voltage Drain Current
Gate–Body Leakage
V DS = 24 V,
V GS = ±16 V,
V GS = 0 V
V DS = 0 V
500
±100
μ A
nA
On Characteristics
(Note 2)
V GS(th)
Gate Threshold Voltage
V DS = V GS ,
I D = 1 mA
1
1.4
3
V
? V GS(th)
? T J
Gate Threshold Voltage
Temperature Coefficient
I D = 10 mA, Referenced to 25 ° C
–3.2
mV/ ° C
R DS(on)
Static Drain–Source
On–Resistance
V GS = 10 V, I D = 2.6 A
V GS = 4.5 V, I D = 2.3 A
32
36
40
50
m ?
V GS = 10V, I D = 2.6 A, T J = 125 ° C
45
60
I D(on)
On–State Drain Current
V GS = 10 V, V DS = 5 V
10
A
g FS
Forward Transconductance
V DS = 10V,
I D = 2.6 A
15
S
Dynamic Characteristics
C iss
C oss
C rss
Rg
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 15 V,
f = 1.0 MHz
V GS = 15 mV
V GS = 0 V,
f = 1.0 MHz
630
115
45
2.4
pF
pF
pF
?
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V DD = 15 V,
V GS = 10 V,
V DS = 15 V,
V GS = 5 V
I D = 1 A,
R GEN = 6 ?
I D = 2.6 A,
7
5
21
2.7
5.8
1.3
1.2
14
10
34
5.4
8.1
1.9
1.7
ns
ns
ns
ns
nC
nC
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
0.7
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = 0.7 A
(Note 2)
440
700
mV
Voltage
trr
Diode Reverse Recovery Time
I F = 2.6 A,
10
ns
Qrr
Diode Reverse Recovery Charge
d iF /d t = 300 A/μs
(Note 2)
4
nC
Notes:
1.
R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 250 ° C/W when mounted on a
0.02 in 2 pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
b) 270°C/W when mounted on a
minimum pad.
2.
Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDN372S Rev C(W)
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