参数资料
型号: FDS6900AS
厂商: Fairchild Semiconductor
文件页数: 7/10页
文件大小: 0K
描述: MOSFET N-CH DUAL 30V 8SOIC
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 2,500
系列: PowerTrench®
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6.9A,8.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 27 毫欧 @ 6.9A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 10V
输入电容 (Ciss) @ Vds: 600pF @ 15V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
Typical Characteristics Q1
10
I D = 6.9A
800
f = 1 MHz
V GS = 0 V
8
V DS = 10V
20V
600
C iss
6
400
15V
4
C oss
200
2
C rss
0
0
0
2
4 6 8
Q g , GATE CHARGE (nC)
10
12
0
5
10 15 20 25
V DS , DRAIN TO SOURCE VOLTAGE (V)
30
Figure 18. Gate Charge Characteristics.
100
50
Figure 19. Capacitance Characteristics.
SINGLE PULSE
10
R DS(ON) LIMIT
1ms
100 μ s
40
R θ JA = 135°C/W
T A = 25°C
10ms
1s
100ms
30
1
10s
V GS = 10V
DC
20
0.1
SINGLE PULSE
R θ JA = 135 C/W
0.01
o
T A = 25 o C
10
0
0.1
1 10
V DS , DRAIN-SOURCE VOLTAGE (V)
100
0.001
0.01
0.1
1
t 1 , TIME (sec)
10
100
1000
Figure 20. Maximum Safe Operating Area.
Figure 21. Single Pulse Maximum
Power Dissipation.
1
R θ JA = 135 C/W
D = 0.5
0.2
R θ JA (t) = r(t) * R θ JA
o
0.1
0.1
0.05
0.02
P(pk)
t 1
0.01
0.01
t 2
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 / t 2
SINGLE PULSE
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t 1 , TIME (sec)
Figure 22. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDS6900AS Rev B (X)
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