参数资料
型号: FDZ193P
厂商: Fairchild Semiconductor
文件页数: 2/7页
文件大小: 0K
描述: MOSFET P-CH 20V 3A 8-WLCSP
产品目录绘图: 6-WL-CSP Package
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3A
开态Rds(最大)@ Id, Vgs @ 25° C: 90 毫欧 @ 1A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 10V
输入电容 (Ciss) @ Vds: 660pF @ 10V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 6-UFBGA,WLCSP
供应商设备封装: 6-WLCSP
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDZ193PDKR
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
BV DSS
T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = -250 A, V GS = 0V
I D = -250 A, referenced to 25°C
V DS = -16V, V GS = 0V
V GS = ±12V, V GS = 0V
-20
-11
-1
±100
V
mV/° C
A
nA
On Characteristics
V GS(th)
V GS(th)
T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = -250 A
I D = -250 A, referenced to 25°C
-0.6
-0.9
3
-1.5
V
mV/°C
V GS = -4.5V, I D = -1A
66
90
r DS(on)
Drain to Source On Resistance
V GS = -2.5V, I D = -1A
V GS = -1.7V, I D = -1A
92
195
130
300
m
V GS = -4.5V, I D = -1A T J = 125°C
84
123
I D(on)
g FS
On to State Drain Current
Forward Transconductance
V GS = -4.5V, V DS = -5V
V DS = -5V, I D = -1A
-10
5.6
A
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = -10V, V GS = 0V,
f = 1MHz
f = 1MHz
660
150
90
9.5
pF
pF
pF
Switching Characteristics
t d(on)
t r
t d(off)
t f
Q g(TOT)
Q gs
Q gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
V DD = -10V, I D = -1A
V GS = -4.5V, R GEN = 6
V GS = 0V to 10V V DD = -10V
I D = -1A
13
10
28
21
7
1
2
23
20
45
34
10
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics
I S
Maximum continuous Drain-Source Diode Forward Current
-1.1
A
V SD
Source to Drain Diode Forward Voltage
V GS = 0V, I S = -1.1A
(Note 2)
-0.7
-1.2
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = -1A, di/dt = 100A/ s
19
6
ns
nC
Notes:
1: R JA is determined with the device mounted on a 1in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. The thermal resistance from the junction to the circuit board
side of the solder ball, R JB is defined for reference. For R JC the thermal reference point for the case is defined as the top surface of the copper chip carrier. R JC and R JB
are guaranteed by design while R JA is determined by the user's board design.
a. 65°C/W when mounted on
a 1 in 2 pad of 2 oz copper,1.5”
X 1.5” X 0.062” thick PCB
2: Pulse Test: Pulse Width < 30 0 s, Duty cycle < 2.0%.
b. 133°C/W when mounted on a
minimum pad of 2 oz copper
FDZ193P Rev.C2 (W)
2
www.fairchildsemi.com
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