参数资料
型号: FSB50550TB
厂商: Fairchild Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MODULE SPM 500V 1.2A SPM23-AC
标准包装: 15
系列: SPM®
类型: FET
配置: 三相反相器
电流: 1.8A
电压: 500V
电压 - 隔离: 1500Vrms
封装/外壳: 23-DIP 模块
January 2014
FSB50550T
Motion SPM ? 5 Series
Features
? UL Certified No. E209204 (UL1557)
? 500 V R DS(on) = 1.7 ?? Max ? FRFET MOSFET 3-Phase
Inverter with Gate Drivers
? Separate Open-Source Pins from Low-Side MOSFETs
for Three-Phase Current-Sensing
? Active-HIGH Interface, Works with 3.3 / 5 V Logic,
Schmitt-trigger Input
? Optimized for Low Electromagnetic Interference
? HVIC for Gate Driving and Under-Voltage Protection
? Isolation Rating: 1500 V rms / min.
? RoHS Compliant
Applications
? 3-Phase Inverter Driver for Small Power AC Motor
Drives
Package Marking & Ordering Information
Related Source
? AN-9082 - Motion SPM5 Series Thermal Performance
by Contact Pressure
? AN-9080 - User ’s Guide for Motion SPM 5 Series
Ver.1
General Description
The FSB50550T is an advanced Motion SPM ? 5 module
providing a fully-featured, high-performance inverter
output stage for AC Induction, BLDC and PMSM motors.
These modules integrate optimized gate drive of
the built-in MOSFETs (FRFET ? technology) to minimize
EMI and losses. The built-in, high-speed HVIC requires
only a single supply voltage and translates the incoming
logic-level gate inputs to the high-voltage, high-current
drive signals required to properly drive the module's
internal MOSFETs. Separate open-source MOSFET
terminals are available for each phase to support the
widest variety of control algorithms.
Device
FSB50550T
Device Marking
FSB50550T
Package
SPM5F-023
Packing Type
Rail
Quantity
15
?2007 Fairchild Semiconductor Corporation
FSB50550T Rev. C4
1
www.fairchildsemi.com
相关PDF资料
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相关代理商/技术参数
参数描述
FSB50550TB2 功能描述:IGBT 模块 1.2A 500V SPM5 RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSB50550U 功能描述:IGBT 模块 500V/1.2A Motion-SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSB50550US 功能描述:IGBT 模块 500V, 1.2A RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSB50550UTD 功能描述:IGBT 模块 Smart Power Module RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSB50660SF 功能描述:分立半导体模块 Motion SPM 5 SuperFET Series RoHS:否 制造商:Fairchild Semiconductor 产品: 类型: 安装风格: 封装 / 箱体: 封装:Tube