参数资料
型号: FSBB20CH60
厂商: Fairchild Semiconductor
文件页数: 11/14页
文件大小: 0K
描述: SMART POWER MODULE 20A SPM27-CA
产品培训模块: Smart Power
产品变化通告: Wire Bonding Change 06/April/2007
标准包装: 10
系列: SPM™
类型: IGBT
配置: 3 相
电流: 20A
电压: 600V
电压 - 隔离: 2500Vrms
封装/外壳: SPM27CA
配用: FEB154-ND - BOARD EVAL FOR FSBB20CH60
其它名称: FSBB20CH60-ND
FSBB20CH60FS
FSBB20CH60_NL
FSBB20CH60_NL-ND
+5 V
R PF = 4.7 k ?
SPM
IN (UH) , IN (VH) , IN (WH)
MCU
100 ?
1 nF
C PF = 1 nF
IN (UL) , IN (VL) , IN (WL)
V FO
COM
Figure 9. Recommended MCU I/O Interface Circuit
3rd Notes:
1. RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme in the application and the wiring impedance of the application’s printed
circuit board. The Motion SPM ? 3 Product input signal section integrates a 3.3 k ? ( typ.) pull-down resistor. Therefore, when using an external filtering resistor, pay attention to
the signal voltage drop at input terminal.
2. The logic input works with standard CMOS or LSTTL outputs.
These values depend on PWM control algorithm.
+15 V
R E(H)
R BS
D BS
One-Leg Diagram of
Motion SPM 3 Product
P
22 μ F
0.1 μ F
Vcc VB
IN HO
COM VS
Vcc
Inverter
Output
1000 μ F
1 μ F
IN
OUT
COM V SL
N
Figure 10. Recommended Bootstrap Operation Circuit and Parameters
3rd Notes:
3. It would be recommended that the bootstrap diode, D BS , has soft and fast recovery characteristics.
4. The bootstrap resistor (R BS ) should be three times greater than R E(H) . The recommended value of R E(H) is 5.6 ? , but it can be increased up to 20 ?? (maximum) for a slower dv/
dt of high-side.
5. The ceramic capacitor placed between V CC - COM should be over 1 ? F and mounted as close to the pins of the Motion SPM 3 product as possible.
?2006 Fairchild Semiconductor Corporation
FSBB20CH60 Rev. C6
11
www.fairchildsemi.com
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参数描述
FSBB20CH60B 功能描述:IGBT 模块 600V -20A 3-phase RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60BT 功能描述:IGBT 模块 600V -20A 3-phase RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60C 功能描述:IGBT 模块 600V 20A SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60CL 功能描述:IGBT 模块 20A, Motion-SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60CT 功能描述:IGBT 模块 600V 20A SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装: