参数资料
型号: HFA3101B96
厂商: Intersil
文件页数: 12/12页
文件大小: 0K
描述: IC TRANS ARRAY NPN GILBERT 8SOIC
标准包装: 2,500
频率: 0Hz ~ 10GHz
混频器数目: 1
噪音数据: 1.7dB
包装: 带卷 (TR)
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
HFA3101
Die Characteristics
PROCESS
UHF-1
DIE DIMENSIONS:
53 mils x 52 mils x 14 mils
1340 μ m x 1320 μ m x 355.6 μ m
METALLIZATION:
Type: Metal 1: AlCu(2%)/TiW
Thickness: Metal 1: 8k ? ± 0.5k ?
Type: Metal 2: AlCu(2%)
Thickness: Metal 2: 16k ? ± 0.8k ?
Metallization Mask Layout
HFA3101
PASSIVATION:
Type: Nitride
Thickness: 4k ? ± 0.5k ?
SUBSTRATE POTENTIAL (Powered Up):
Floating
8
8
1
1
7
2
7
2
6
3
6
3
5
5
4
4
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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