参数资料
型号: HYS72T64000EP-3.7-B2
厂商: QIMONDA AG
元件分类: DRAM
英文描述: 64M X 72 DDR DRAM MODULE, DMA240
封装: GREEN, RDIMM-240
文件页数: 16/64页
文件大小: 3411K
代理商: HYS72T64000EP-3.7-B2
HYS72T[64/128/256]xx0EP–[2.5/25F/3/3S/3.7]–B2
Registered DDR2 SDRAM Modules
Internet Data Sheet
Rev. 1.02, 2008-06
23
07312007-HYD2-P177
1)
V
DDQ = 1.8 V ± 0.1V; VDD = 1.8 V ± 0.1 V.
2) Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down
and then restarted through the specified initialization sequence before normal operation can continue.
3) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew
Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode.
4) The CK / CK input reference level (for timing reference to CK / CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS,
input reference level is the crosspoint when in differential strobe mode.
5) Inputs are not recognized as valid until
V
REF stabilizes. During the period before VREF stabilizes, CKE = 0.2 x VDDQ is recognized as low.
6) The output timing reference voltage level is
V
TT.
7) For each of the terms, if not already an integer, round to the next highest integer.
t
CK refers to the application clock period. WR refers to
the WR parameter stored in the MR.
8) The clock frequency is allowed to change during self-refresh mode or precharge power-down mode.
9) For timing definition, refer to the Component data sheet.
10) Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers as well as output Slew Rate
mis-match between DQS / DQS and associated DQ in any given cycle.
11) MIN (
t
CL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this value can
be greater than the minimum specification limits for
t
CL and tCH).
Data output hold time from DQS
t
QH
t
HP tQHS
Data hold skew factor
t
QHS
400
ps
Average periodic refresh Interval
t
REFI
—7.8
μs
Average periodic refresh Interval
t
REFI
—3.9
μs
Auto-Refresh to Active/Auto-Refresh
command period
t
RFC
105
ns
Read preamble
t
RPRE
0.9
1.1
t
CK
Read postamble
t
RPST
0.40
0.60
t
CK
Active bank A to Active bank B command
period for 1 KB page size
t
RRD
7.5
ns
Internal Read to Precharge command
delay
t
RTP
7.5
ns
Write preamble
t
WPRE
0.25
t
CK
Write postamble
t
WPST
0.40
0.60
t
CK
Write recovery time for write without
Auto-Precharge
t
WR
15
ns
Internal Write to Read command delay
t
WTR
7.5
ns
Exit power down to any valid command
(other than NOP or Deselect)
t
XARD
2—
t
CK
Exit active power-down mode to Read
command (slow exit, lower power)
t
XARDS
6 – AL
t
CK
Exit precharge power-down to any valid
command (other than NOP or Deselect)
t
XP
2—
t
CK
Exit Self-Refresh to non-Read command
t
XSNR
t
RFC +10
ns
Exit Self-Refresh to Read command
t
XSRD
200
t
CK
Write recovery time for write with Auto-
Precharge
WR
t
WR/tCK
t
CK
Parameter
Symbol
DDR2–533
Unit
Notes
1)2)3)4)5)
6)
Min.
Max.
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