参数资料
型号: IBM25PPC405GP-3DE266CZ
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA456
封装: 27 X 27 MM, ENHANCED, PLASTIC, BGA-456
文件页数: 37/60页
文件大小: 1480K
代理商: IBM25PPC405GP-3DE266CZ
PowerPC 405GP Embedded Processor Data Sheet
Page 42 of 60
6/20/03
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to +2.7
V
Supply Voltage (I/O Interface)
OVDD
0 to +3.6
V
PLL Supply Voltage
AVDD
0 to +2.7
V
Input Voltage (2.5 V CMOS receivers)
VIN
-0.6 to VDD + 0.6
V
Input Voltage (3.3 V LVTTL receivers)
VIN
-0.6 to OVDD + 0.6
V
Input Voltage (5.0 V LVTTL receivers)
VIN
-0.6 to OVDD + 2.4
V
Storage Temperature Range
TSTG
-55 to +150
°C
Case temperature under bias
TC
-40 to +120
°C
Note: All specified voltages are with respect to GND.
Package Thermal Specifications
The PPC405GP is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values for
the E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
35 mm, 456-balls—Junction-to-Case
θ
JC
222
°C/W
35mm, 456-balls—Case-to-Ambient1
θ
CA
14
13
12
°C/W
27 mm, 456-balls—Junction-to-Case
θ
JC
222
°C/W
27mm, 456-balls—Case-to-Ambient1
θ
CA
18
16
15
°C/W
25 mm, 413-balls—Junction-to-Case
θ
JC
1.5
°C/W
25mm, 413-balls—Case-to-Ambient1
θ
CA
17
15
13
°C/W
Note:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.
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