参数资料
型号: IBM25PPC750-EB0M2250
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 225 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 28/42页
文件大小: 496K
代理商: IBM25PPC750-EB0M2250
Page 34
v 3.2
Datasheet
7/15/99
PowerPC 750TM SCM RISC Microprocessor
Preliminary Copy
Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die junction temperature, heat sinks may be attached
to the package by several methods; adhesive, spring clip to holes in the printed-circuit board or package, and
mounting clip and screw assembly; see Figure 24. This spring force should not exceed 5.5 pounds.
Figure 24. Package Exploded Cross-Sectional View with Several Heat Sink Options
CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Option
Circuit
Board
相关PDF资料
PDF描述
ICS9147F-08 100 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48
ICS9148F-13 100 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48
ICS9148YF-111 100 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48
IS80C52-24PL 8-BIT, MROM, 24 MHz, MICROCONTROLLER, PQCC44
IBM25NPE405H-3DA266C 32-BIT, 266 MHz, RISC PROCESSOR, PBGA580
相关代理商/技术参数
参数描述
IBM25PPC750FL-GR0123V 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays
IBM25PPC750FL-GR0124V 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays
IBM25PPC750FL-GR0133T 制造商:IBM 功能描述:IBMIBM25PPC750FL-GR0133T CSOI9SG LOGIC P
IBM25PPC750FL-GR0133V 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays
IBM25PPC750FL-GR1024T 制造商:IBM 功能描述: