参数资料
型号: IBM25PPC750-EB0M2250
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 225 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 40/42页
文件大小: 496K
代理商: IBM25PPC750-EB0M2250
7/15/99
v 3.2
Datasheet
Page 7
Preliminary Copy
PowerPC 750TM SCM RISC Microprocessor
Electrical and Thermal Characteristics
This section provides both AC and DC electrical specifications and thermal characteristics for the 750.
DC Electrical Characteristics
The tables in this section describe the 750’s DC electrical characteristics. Table 1 provides the absolute max-
imum ratings.
Table 2 provides the recommended operating conditions for the 750.
Table 1.
Absolute Maximum Ratings
Characteristic
Symbol
Value
Unit
Core supply voltage
VDD
-0.3 to 2.75
V
PLL supply voltage
AVDD
-0.3 to 2.75
V
L2 DLL supply voltage
L2AVDD
-0.3 to 2.75
V
60x bus supply voltage
OVDD
-0.3 to 3.6
V
L2 bus supply voltage
L2OVDD
-0.3 to 3.6
V
Input voltage
VIN
-0.3 to 3.6
V
Storage temperature range
TSTG
-55 to 150
°C
Note:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and func-
tional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause per-
manent damage to the device.
2. Caution: VIN must not exceed OVDD by more than 0.3V at any time, including during power-on reset.
3. Caution: OVDD must not exceed VDD/AVDD by more than 1.2V at any time, including during power-on reset.
4. Caution: VDD/AVDD must not exceed OVDD by more than 0.4V at any time, including during power-on reset.
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