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参数资料
| 型号： | IBM25PPC750-EB0M2250 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 225 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 29/42页 |
| 文件大小： | 496K |
| 代理商： | IBM25PPC750-EB0M2250 |
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7/15/99
v 3.2
Datasheet
Page 35
Preliminary Copy
PowerPC 750TM SCM RISC Microprocessor
The board designer can choose between several types of heat sinks to place on the 750. There are several
commercially-available heat sinks for the 750 provided by the following vendors.
Chip Coolers, Inc.
333 Strawberry Field Rd.
800-227-0254 (USA/Canada)
Warwick, RI 02887-6979
401-739-7600
Thermalloy
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
214-243-4321
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
818-842-7277
Aavid Engineering
One Kool Path
Laconic, NH 03247-0440
603-528-3400
Wakefield Engineering
60 Audubon Rd.
Wakefield, MA 01880
617-245-5900
Ultimately, the final selection of an appropriate heat sink for the 750 depends on many factors, such as ther-
mal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Internal Package Conduction Resistance
For the exposed die packaging technology (shown in Table 3), the intrinsic conduction thermal resistance
paths are as follows.
Die junction-to-case thermal resistance.
Die junction-to-lead thermal resistance.
Figure 25 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
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相关代理商/技术参数 |
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|---|---|
| IBM25PPC750FL-GR0123V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR0124V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR0133T | 制造商:IBM 功能描述:IBMIBM25PPC750FL-GR0133T CSOI9SG LOGIC P |
| IBM25PPC750FL-GR0133V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR1024T | 制造商:IBM 功能描述: |
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