参数资料
型号: IBM25PPC750-EB0M2250
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 225 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 32/42页
文件大小: 496K
代理商: IBM25PPC750-EB0M2250
Page 38
v 3.2
Datasheet
7/15/99
PowerPC 750TM SCM RISC Microprocessor
Preliminary Copy
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors.
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Thermagon, Inc.
216-741-7659
3256 West 25th Street
Cleveland, OH 44109-1668
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067
AI Technology (e.g. EG7655)
609-882-2332
1425 Lower Ferry Road
Trent, NJ 08618
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
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