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参数资料
| 型号： | IBM25PPC750-EB0M2250 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 225 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 30/42页 |
| 文件大小： | 496K |
| 代理商： | IBM25PPC750-EB0M2250 |
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Page 36
v 3.2
Datasheet
7/15/99
PowerPC 750TM SCM RISC Microprocessor
Preliminary Copy
Heat generated on the active side (ball) of the chip is conducted through the silicon, then through the heat
sink attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-
air convection. Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature
drop in the silicon may be neglected. Thus, the heat sink attach material and the heat sink conduction/con-
vective thermal resistances are the dominant terms.
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by a spring clip mechanism,
Figure 26 shows the thermal performance of three thin-sheet thermal-interface materials (silicon, graphite/oil,
floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown, the
performance of these thermal interface materials improves with increasing contact pressure. The use of ther-
mal grease significantly reduces the interface thermal resistance. That is, the bare joint results in a thermal
resistance approximately 7 times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 24). This spring force should not exceed 5.5 pounds. Therefore the synthetic grease offers the best
thermal performance, considering the low interface pressure. Of course, the selection of any thermal inter-
face material depends on many factors; thermal performance requirements, manufacturability, service tem-
perature, dielectric properties, cost, etc.
Figure 25. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Die/Package
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Chip Junction
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相关代理商/技术参数 |
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|---|---|
| IBM25PPC750FL-GR0123V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR0124V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR0133T | 制造商:IBM 功能描述:IBMIBM25PPC750FL-GR0133T CSOI9SG LOGIC P |
| IBM25PPC750FL-GR0133V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR1024T | 制造商:IBM 功能描述: |
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