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参数资料
| 型号： | IBM25PPC750-EB0M2250 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 225 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 41/42页 |
| 文件大小： | 496K |
| 代理商： | IBM25PPC750-EB0M2250 |
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Page 8
v 3.2
Datasheet
7/15/99
PowerPC 750TM SCM RISC Microprocessor
Preliminary Copy
Table 3 provides the package thermal characteristics for the 750.
The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-ana-
log converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the 750 RISC
Microprocessor User’s Manual for more information on the use of this feature. Specifications for the thermal
sensor portion of the TAU are found in Table 4.
Table 5 provides DC electrical characteristics for the 750.
Table 2.
Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Core supply voltage
VDD
2.65 to 2.75
V
PLL supply voltage
AVDD
2.65 to 2.75
V
L2 DLL supply voltage
L2AVDD
2.65 to 2.75
V
60x bus supply voltage
OVDD
3.135 to 3.465
V
L2 bus supply voltage
L2OVDD
3.135 to 3.465 or VDD
V
Input voltage
VIN
GND to OVDD
V
Die-junction temperature
TJ
0 to 65
°C
Note: These are recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
Table 3.
Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
CBGA package thermal resistance, junction-to-case thermal resistance
(typical)
θJC
0.03
°C/W
CBGA package thermal resistance, junction-to-lead thermal resistance
(typical)
θJB
3.8
°C/W
Note: Refer to Section, “Thermal Management Information” on page 34 for more information about thermal management.
Table 4.
Thermal Sensor Specications
See Table 2 for operating conditions.
Num
Characteristic
Min
Max
Unit
Notes
1
Temperature range
0
128
°C
1
2
Comparator settling time
20
—
ms
2
3
Resolution
4
—
°C
3
Note:
1.The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not
indicate an absolute temperature, but it must be interpreted by software to derive the absolute junction tem-
perature. For information on how to use and calibrate the TAU, contact your local IBM sales ofce. This spec-
ication reects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written
into the THRM3 SPR.
3. This value is guaranteed by design and is not tested.
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