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参数资料
| 型号： | IDT70T3539MS133BC8 |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 24/26页 |
| 文件大小： | 0K |
| 描述： | IC SRAM 18MBIT 133MHZ 256BGA |
| 标准包装： | 1,000 |
| 格式 - 存储器： | RAM |
| 存储器类型： | SRAM - 双端口，同步 |
| 存储容量： | 18M（512K x 36） |
| 速度： | 133MHz |
| 接口： | 并联 |
| 电源电压： | 2.4 V ~ 2.6 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-CABGA（17x17） |
| 包装： | 带卷 (TR) |
| 其它名称： | 70T3539MS133BC8 |
IDT70T3539M
High-Speed 2.5V 512K x 36 Dual-Port Synchronous Static RAM
Identification Register Definitions
Industrial and Commercial Temperature Ranges
Instruction Field Array B
Revision Number (31:28)
IDT Device ID (27:12)
IDT JEDEC ID (11:1)
ID Register Indicator Bit (Bit 0)
Value
Array B
0x0
0x333
0x33
1
Instruction Field Array A
Revision Number (63:60)
IDT Device ID (59:44)
IDT JEDEC ID (43:33)
ID Register Indicator Bit (Bit 32)
Value
Array A
0x0
0x333
0x33
1
Description
Reserved for Version number
Defines IDT Part number
Allows unique identification of device vendor as IDT
Indicates the presence of an ID Register
5678 tbl 16
Scan Register Sizes
Register Name
Instruction (IR)
Bypass (BYR)
Identification (IDR)
Boundary Scan (BSR)
Bit Size
Array A
4
1
32
Note (3)
Bit Size
Array B
4
1
32
Note (3)
Bit Size
70T3539M
8
2
64
Note (3)
5678 tbl 17
System Interface Parameters
Instruction
EXTEST
BYPASS
IDCODE
HIGHZ
CLAMP
SAMPLE/PRELOAD
RESERVED
PRIVATE
Code
00000000
11111111
00100010
01000100
00110011
00010001
01010101, 01110111,
10001000, 10011001,
10101010, 10111011,
11001100
01100110,11101110,
Description
Forces contents of the boundary scan cells onto the device outputs (1) .
Places the boundary scan register (BSR) between TDI and TDO.
Places the bypass register (BYR) between TDI and TDO.
Loads the ID register (IDR) with the vendor ID code and places the
register between TDI and TDO.
Places the bypass register (BYR) between TDI and TDO. Forces all
device output drivers except INT x and COL x to a High-Z state.
Uses BYR. Forces contents of the boundary scan cells onto the device
outputs. Places the bypass register (BYR) between TDI and TDO.
Places the boundary scan register (BSR) between TDI and TDO.
SAMPLE allows data from device inputs (2) to be captured in the
boundary scan cells and shifted serially through TDO. PRELOAD allows
data to be input serially into the boundary scan cells via the TDI.
Several combinations are reserved. Do not use codes other than those
identified above.
For internal use only.
11011101
5678 tbl 18
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS, and TRST .
3. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local
IDT sales representative.
6.42
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT70T3539MS133BCG | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 18MBIT 133MHZ 256CABGA |
| IDT70T3539MS133BCGI | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 18MBIT 133MHZ 256CABGA |
| IDT70T3539MS133BCI | 功能描述:IC SRAM 18MBIT 133MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| IDT70T3539MS133BCI8 | 功能描述:IC SRAM 18MBIT 133MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| IDT70T3539MS166BC | 功能描述:IC SRAM 18MBIT 166MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
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