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参数资料
| 型号： | IDT70T653MS12BCI |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 21/24页 |
| 文件大小： | 0K |
| 描述： | IC SRAM 18MBIT 12NS 256BGA |
| 标准包装： | 12 |
| 格式 - 存储器： | RAM |
| 存储器类型： | SRAM - 双端口，异步 |
| 存储容量： | 18M（512K x 36） |
| 速度： | 12ns |
| 接口： | 并联 |
| 电源电压： | 2.4 V ~ 2.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-CABGA（17x17） |
| 包装： | 托盘 |
| 其它名称： | 70T653MS12BCI 800-2604 IDT70T653MS12BCI-ND |
IDT70T653M
High-Speed 2.5V 512K x 36 Asynchronous Dual-Port Static RAM
Sleep Mode
The IDT70T653M is equipped with an optional sleep or low power
mode on both ports. The sleep mode pin on both ports is active high. During
normal operation, the ZZ pin is pulled low. When ZZ is pulled high, the
port will enter sleep mode where it will meet lowest possible power
conditions. The sleep mode timing diagram shows the modes of operation:
Normal Operation, No Read/Write Allowed and Sleep Mode.
For a period of time prior to sleep mode and after recovering from sleep
mode (t ZZS and t ZZR ), new reads or writes are not allowed. If a write or read
JTAG Functionality and Configuration
The IDT70T653M is composed of two independent memory arrays,
and thus cannot be treated as a single JTAG device in the scan chain.
The two arrays (A and B) each have identical characteristics and
commands but must be treated as separate entities in JTAG operations.
Please refer to Figure 5.
JTAG signaling must be provided serially to each array and utilizes
Industrial and Commercial Temperature Ranges
operation occurs during these periods, the memory array may be
corrupted. Validity of data out from the RAM cannot be guaranteed
immediately after ZZ is asserted (prior to being in sleep).
During sleep mode the RAM automatically deselects itself. The RAM
disconnects its internal buffer. All outputs will remain in high-Z state while
in sleep mode. All inputs are allowed to toggle. The RAM will not be selected
and will not perform any reads or writes.
Register Sizes, and System Interface Parameter tables. Specifically,
commands for Array B must precede those for Array A in any JTAG
operations sent to the IDT70T653M. Please reference Application Note
AN-411, "JTAG Testing of Multichip Modules" for specific instructions on
performing JTAG testing on the IDT70T653M. AN-411 is available at
www.idt.com.
the information provided in the Identification Register Definitions, Scan
IDT70T653M
TDI
Array A
TDOA
TDIB
Array B
TDO
TCK
TMS
TRST
5679 drw 23
Figure 5. JTAG Configuration for IDT70T653M
21
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| IDT70T653MS12BCI8 | 功能描述:IC SRAM 18MBIT 12NS 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| IDT70T653MS15BC | 功能描述:IC SRAM 18MBIT 15NS 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| IDT70T653MS15BC8 | 功能描述:IC SRAM 18MBIT 15NS 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| IDT70T659S10BC | 功能描述:IC SRAM 4MBIT 10NS 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| IDT70T659S10BC8 | 功能描述:IC SRAM 4MBIT 10NS 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
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