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参数资料
| 型号： | IDT79RC32V334-133BB9 |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 133 MHz, RISC MICROCONTROLLER, PBGA256 |
| 封装： | PLASTIC, BGA-256 |
| 文件页数： | 25/30页 |
| 文件大小： | 652K |
| 代理商： | IDT79RC32V334-133BB9 |
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November 1, 2001
79RC32334
Secondly, the RC32334 implements additional reporting signals
intended to simplify the task of system debugging when using a logic
analyzer. This product allows the logic analyzer to differentiate transac-
tions initiated by DMA from those initiated by the CPU and further allows
CPU transactions to be sorted into instruction fetches vs. data fetches.
Finally, the RC32334 implements a full boundary scan capability,
allowing board manufacturing diagnostics and debug.
Packaging
The RC32334 is packaged using a 256-lead PBGA package, with
1.0mm ball spacing.
Thermal Considerations
The RC32334 consumes less than 2.1 W peak power. The device is
guaranteed in an ambient temperature range of 0
° to +85° C for
commercial temperature devices; -40
° to +85° for industrial temperature
devices.
Revision History
May 16, 2000: Initial version.
June 8, 2000: In CPU Core Specific Signals section of Table 1,
changed cpu_dr_r_n pin from Input to Output. Updated document from
Advance to Preliminary Information.
June 15, 2000: In Table 1, switched assertion and de-assertion for
debug_cpu_dma_n signal. In the AC Timing Characteristics table,
added SPI section and adjusted parameters in the Reset section.
July 12, 2000: Removed “Preliminary Information” statement. Added
information regarding external pull-ups and pull-downs to the Pin
Description Table. Made minor revisions in other parts of the data sheet.
August 3, 2000: Added Pin Layout diagram showing power and
ground pins. Revised Power Curves section to reflect support of only 2x,
3x, and 4x.
August 30, 2000: Added Standby mode and values to Power
Consumption table. Extended Power Curve figure to 75 MHz.
September 25, 2000: Changed MIPS32 ISA to Enhanced MIPS-II. In
Local System Interface section of Table 6, changed Thld2 values for
mem_data[31:0] from 1.8 to 1.5 ns and changed Tdoh3 values for
mem_addr[25:2], etc. from 1.8 to 1.5 ns.
December 12, 2000: Changed Max values for cpu_masterclock
period in Table 5 and added footnote. In Table 1, added 2nd alternate
function for spi_mosi, spi_miso, spi_sck. In Table 10, removed the “1”
from Alt column for cpu_masterclk and added “2” in Alt column for pins
G3, G4, H2. In RC32334 Alternate Signal Functions table: added pin T2;
added pin names in Alt #2 column for pins G3, G4, H2; added PIO[11] to
Alt #2 column for pin R3.
January 4, 2001: In Table 6 under Interrupt Handling, moved the
values for Tsu9 from the Max to the Min columns.
March 13, 2001: Changed upper ambient temperature for industrial
and commercial uses from +70
° C to +85° C.
June 7, 2001: In the Clock Parameters table, added footnote 3 to
output_clk category and added NA to Min and Max columns. In Figure 3
(Reset Specification), enhanced signal line for cpu_masterclk. In Local
System Interface section of AC Timing Characteristics table, changed
values in Min column for last category of signals (Tdoh3) from 1.5 to 2.5
for all speeds. In SDRAM Controller section of same table, changed
values in Min column for last category of signals (9 signals) from 1 to 2.5
for all speeds.
September 14, 2001: In the Reset category of Table 6: switched
mem_addr[19:17] from Tsu22 and Thld22 to Tsu10 and Thld10;
switched mem_addr[22:20] from Tsu10 and Thld10 to Tsu22 and
Thld22; moved ejtag_pcst[2:0] from Reset to Debug Interface category
under Tsu20 and Thld20.
November 1, 2001: Added Input Voltge Undershoot parameter and
2 footnotes to Table 10.
相关PDF资料 |
PDF描述 |
|---|---|
| IDT79RC32V334-100BBI | 32-BIT, 100 MHz, RISC MICROCONTROLLER, PBGA256 |
| IDT79RC32V334-133BB8 | 32-BIT, 133 MHz, RISC MICROCONTROLLER, PBGA256 |
| IDT79RC32V334-150BB9 | 32-BIT, 150 MHz, RISC MICROCONTROLLER, PBGA256 |
| IDT79RC32V334-133BBI9 | 32-BIT, 133 MHz, RISC MICROCONTROLLER, PBGA256 |
| IDT79RC32V364-100DAGI | 32-BIT, 100 MHz, RISC PROCESSOR, PQFP144 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT79RC32V334-133BBG | 功能描述:IC PROC 32BIT CORE 133MHZ 256BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32V334-133BBGI | 功能描述:IC PROC 32BIT CORE 133MHZ 256BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32V334-133BBI | 功能描述:IC PROC 32BIT CORE 133MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32V334-133BBI8 | 功能描述:IC PROC 32BIT CORE 133MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE（27x27） 包装:托盘 |
| IDT79RC32V334-150BB | 功能描述:IC PROC 32BIT CORE 150MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
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