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参数资料
| 型号： | IR3503MTRPBF |
| 厂商： | International Rectifier |
| 文件页数： | 29/39页 |
| 文件大小： | 0K |
| 描述： | IC CTRL XPHASE VR11.0/1 32-MLPQ |
| 标准包装： | 1 |
| 系列： | XPhase3™ |
| 应用： | 处理器 |
| 电流 - 电源： | 8mA |
| 电源电压： | 4.75 V ~ 7.5 V |
| 工作温度： | 0°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-MLPQ（5x5） |
| 包装： | 标准包装 |
| 其它名称： | IR3503MTRPBFDKR |
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IR3503
C SS / DEL =
TD 2 * I CHG
V O
=
TD 2 * 52 . 5 * 10 ? 6
V O
(7)
The soft start delay time (TD1) and VR ready delay time (TD3) are determined by (8) to (9) respectively.
TD 1 =
C SS / DEL * 1 .4
I CHG
=
C SS / DEL * 1. 4
52 . 5 * 10 ? 6
(8)
TD 3 =
C SS / DEL * ( 4. 0 ? V O )
I CHG
=
C SS / DEL * ( 4. 0 ? V O )
52 . 5 * 10 ? 6
(9)
Once C SS/DEL is chosen, the minimum over-current fault latch delay time t OCDEL is fixed and can be quantified as
t OCDEL =
C SS / DEL * 0 .12
I DISCHG
=
C SS / DEL * 0. 12
55 * 10 ? 6
(10)
VDAC Slew Rate Programming Capacitor C VDAC and Resistor R VDAC
The slew rate of VDAC slope SR DOWN can be programmed by the external capacitor C VDAC as defined in (11),
where I SINK is the sink current of VDAC pin. The slew rate of VDAC up-slope is the same as that of down-slope.
The resistor R VDAC is used to compensate VDAC circuit and can be calculated as follows
C VDAC =
I SINK
SR DOWN
=
44 * 10 ? 6
SR DOWN
(11)
R VDAC =
1
2 ? π ? 900 kHz ? C VDAC
(12)
Current Report Gain and Thermal Compensation
Intel VR11.1 specifications require IMON to report the core maximum load current of the CPU be reported as 1 V
nominal. The core maximum current can be different for different platforms. The IMON tuning resistors can
therefore be adjusted and thermally compensated to adjust the load current gain with respect to the IMON. The
expressions that govern the relationship between load current, IMON, and VDRP at room temperature are given
by
VDRP = VDAC + ? ? ?
? ? ? 1 +
? ? I o
1 ? R L _ room ? G cs
3 ? n
? ?
?
? ?
( RTCMP 3) II ( RTCMP 1 + RTHERM _ room ) ?
RTCMP 3 ?
(13)
IMON = ? ? ?
? ? ? 1 +
? ? I o
1 ? R L _ room ? G cs
3 ? n
? ?
?
? ?
( RTCMP 3) II ( RTCMP 1 + RTHERM _ room ) ?
RTCMP 3 ?
(14)
The change in inductor DCR with temperature is compensated by an equivalent variation in the RTHERM. The
following equations derive the R TCMP1 and R TCMP2 if R TCMP3 and the thermistor (R THERM and β THERM ) are fixed.
R L _ MAX = R L _ room ? [ 1 + 3850 * 10 ? 6 ? ( T L _ MAX ? T room )]
(15)
K THERM _ room =
1 V
I o max
, K c _ room =
( R L _ room ? G cs )
n
, K c _ t max =
( R L _ max ? G cs )
n
(16)
Page 29 of 39
February 12, 2010
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相关代理商/技术参数 |
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|---|---|
| IR3504MPBF | 制造商:International Rectifier 功能描述:Control IC 32-Pin MLPQ Strip |
| IR3504MTRPBF | 功能描述:开关变换器、稳压器与控制器 X-PHASE IR3504 AMD SVID CTRL IC RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| IR3505 | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASE3TM PHASE IC |
| IR3505MPBF | 功能描述:IC XPHASE3 CONTROL 16-MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase3™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3505MTRPBF | 功能描述:开关变换器、稳压器与控制器 XPHASE3 DDR VTT 7V 2A 3 Wire RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
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