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参数资料
| 型号： | IRF6604TR1 |
| 厂商： | International Rectifier |
| 文件页数： | 1/13页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 30V 12A DIRECTFET |
| 产品变化通告： | (EP) Parts Discontinuation 25/May/2012 |
| 标准包装： | 1,000 |
| 系列： | HEXFET® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 30V |
| 电流 - 连续漏极(Id) @ 25° C： | 12A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 11.5 毫欧 @ 12A，7V |
| Id 时的 Vgs(th)（最大）： | 2.1V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 26nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 2270pF @ 15V |
| 功率 - 最大： | 2.3W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | DirectFET? 等容 MQ |
| 供应商设备封装： | DIRECTFET? MQ |
| 包装： | 带卷 (TR) |
l
Application Specific MOSFETs
V DSS
PD - 94365E
IRF6604
HEXFET ? Power MOSFET
R DS(on) max Qg
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
l Low Switching Losses
30V
11.5m ? @V GS = 7.0V
13m ? @V GS = 4.5V
17nC
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount
Techniques
MQ
Applicable DirectFET Outline and Substrate Outline (see p.9,10 for details)
DirectFET ? ISOMETRIC
SQ SX ST
MQ
MX MT
Description
The IRF6604 combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET TM packaging
to achieve the lowest on-state resistance charge product in a package that has the footprint of an SO-8 and only 0.7 mm
profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly
equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed
regarding the manufacturing methods and process. The DirectFET package allows dual sided cooling to maximize
thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6604 balances both low resistance and low charge along with ultra low package inductance to reduce both conduc-
tion and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power
the latest generation of processors operating at higher frequencies. The IRF6604 has been optimized for parameters that
are critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
Parameter
Max.
Units
V DS
V GS
I D @ T C = 25°C
I D @ T A = 25°C
I D @ T A = 70°C
I DM
P D @T A = 25°C
P D @T A = 70°C
P D @T C = 25°C
T J
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V GS @ 7.0V
Continuous Drain Current, V GS @ 7.0V
Continuous Drain Current, V GS @ 7.0V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Power Dissipation
Linear Derating Factor
Operating Junction and
30
±12
49
12
9.2
92
2.3
1.5
42
0.018
-40 to + 150
V
A
W
W/°C
°C
T STG Storage Temperature Range
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JA
R θ JA
Junction-to-Ambient
Junction-to-Ambient
–––
12.5
55
–––
R θ JA
R θ JC
R θ J-PCB
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
20
–––
1.0
–––
3.0
–––
°C/W
Notes ? through ? are on page 11
www.irf.com
1
11/16/05
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