参数资料
型号: IRF6644TR1
厂商: International Rectifier
文件页数: 1/10页
文件大小: 0K
描述: MOSFET N-CH 100V DIRECTFET-MN
产品变化通告: (PMD) Leaded Parts Discontinuation 25/May/2012
标准包装: 1,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 10.3A
开态Rds(最大)@ Id, Vgs @ 25° C: 13 毫欧 @ 10.3A,10V
Id 时的 Vgs(th)(最大): 4.8V @ 150µA
闸电荷(Qg) @ Vgs: 47nC @ 10V
输入电容 (Ciss) @ Vds: 2210pF @ 25V
功率 - 最大: 2.8W
安装类型: 表面贴装
封装/外壳: DirectFET? 等容 MN
供应商设备封装: DIRECTFET? MN
包装: 带卷 (TR)
PD - 96908E
IRF6644
DirectFET ? Power MOSFET ?
l
l
l
RoHs Compliant Containing No Lead and Bromide ?
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible ?
Typical values (unless otherwise specified)
V DSS V GS R DS(on)
100V max ±20V max 10.3m ? @ 10V
l
l
l
Ultra Low Package Inductance
Optimized for High Frequency Switching ?
Ideal for High Performance Isolated Converter
Q g tot
35nC
Q gd
11.5nC
V gs(th)
3.7V
Primary Switch Socket
l
l
l
Optimized for Synchronous Rectification
Low Conduction Losses
Compatible with existing Surface Mount Techniques ?
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details) ?
MN
DirectFET ? ISOMETRIC
SH
SJ
SP
MZ
MN
Description
The IRF6644 combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6644 is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom applications
(36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled
with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements,
and makes this device ideal for high performance isolated DC-DC converters.
Absolute Maximum Ratings
Parameter
Max.
Units
V DS
V GS
I D @ T A = 25°C
I D @ T A = 70°C
I D @ T C = 25°C
I DM
E AS
I AR
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V GS @ 10V
Continuous Drain Current, V GS @ 10V
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
100
±20
10.3
8.3
60
82
220
6.2
V
A
mJ
A
0.08
0.06
0.04
0.02
0.00
TJ = 125°C
TJ = 25°C
I D = 6.2A
13
12
11
10
9
TA= 25°C
VGS = 7.0V
VGS = 8.0V
VGS = 10V
VGS = 15V
4
6
8
10
12
14
16
0
4
8
12
16
20
VGS, Gate-to-Source Voltage (V)
Fig 1. Typical On-Resistance Vs. Gate Voltage
Notes:
? Click on this section to link to the appropriate technical paper.
? Click on this section to link to the DirectFET Website.
? Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
ID, Drain Current (A)
Fig 2. Typical On-Resistance Vs. Drain Current
? T C measured with thermocouple mounted to top (Drain) of part.
? Repetitive rating; pulse width limited by max. junction temperature.
? Starting T J = 25°C, L = 12mH, R G = 25 ? , I AS = 6.2A.
1
6/30/05
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