参数资料
型号: IRF6613
厂商: International Rectifier
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 40V DIRECTFET-MT
标准包装: 4,800
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 40V
电流 - 连续漏极(Id) @ 25° C: 23A
开态Rds(最大)@ Id, Vgs @ 25° C: 3.4 毫欧 @ 23A,10V
Id 时的 Vgs(th)(最大): 2.25V @ 250µA
闸电荷(Qg) @ Vgs: 63nC @ 4.5V
输入电容 (Ciss) @ Vds: 5950pF @ 15V
功率 - 最大: 2.8W
安装类型: 表面贴装
封装/外壳: DirectFET? 等容 MT
供应商设备封装: DIRECTFET? MT
包装: 带卷 (TR)
PD - 95881B
IRF6613
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Application Specific MOSFETs
Ideal for Synchronous Rectification in Isolated
DC-DC Converters
Low Conduction Losses
Low Switching Losses
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques
V DSS
40V
HEXFET ? Power MOSFET
R DS(on) max Qg(typ.)
3.4m ? @V GS = 10V 42nC
4.1m ? @V GS = 4.5V
DirectFET ? ISOMETRIC
MT
Applicable DirectFET Outline and Substrate Outline (see p.8,9 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF6613 combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6613 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching
losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors
operating at higher frequencies. The IRF6613 has been optimized for parameters that are critical in synchronous buck converters including
Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6613 offers particularly low Rds(on) and high Cdv/dt immunity for synchro-
nous FET applications .
Absolute Maximum Ratings
Parameter
Max.
Units
V DS
V GS
I D @ T C = 25°C
I D @ T A = 25°C
I D @ T A = 70°C
I DM
P D @T C = 25°C
P D @T A = 25°C
P D @T A = 70°C
E AS
I AR
T J
T STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V GS @ 10V
Continuous Drain Current, V GS @ 10V
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Power Dissipation
Single Pulse Avalanche Energy
Avalanche Current
Linear Derating Factor
Operating Junction and
Storage Temperature Range
40
±20
150
23
18
180
89
2.8
1.8
200
18
0.022
-40 to + 150
V
A
W
mJ
A
W/°C
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JA
R θ JA
Junction-to-Ambient
Junction-to-Ambient
–––
12.5
45
–––
R θ JA
R θ JC
R θ J-PCB
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
20
–––
1.0
–––
1.4
–––
°C/W
Notes ? through ? are on page 2
www.irf.com
1
9/30/05
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