参数资料
型号: IRLML2502TR
厂商: International Rectifier
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 20V 4.2A SOT-23
标准包装: 1
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 4.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 45 毫欧 @ 4.2A,4.5V
Id 时的 Vgs(th)(最大): 1.2V @ 250µA
闸电荷(Qg) @ Vgs: 12nC @ 5V
输入电容 (Ciss) @ Vds: 740pF @ 15V
功率 - 最大: 1.25W
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: Micro3?/SOT-23
包装: 剪切带 (CT)
其它名称: *IRLML2502TR
IRLML2502
IRLML2502-ND
IRLML2502CT
PD - 93757C
IRLML2502
HEXFET ? Power MOSFET
l
Ultra Low On-Resistance
l
l
l
N-Channel MOSFET
SOT-23 Footprint
Low Profile (<1.1mm)
G 1
3 D
V DSS = 20V
l
l
Available in Tape and Reel
Fast Switching
S
2
R DS(on) = 0.045 ?
Description
These N-Channel MOSFETs from International Rectifier
utilize advanced processing techniques to achieve extremely
low on-resistance per silicon area. This benefit, combined
with the fast switching speed and ruggedized device design
that HEXFET ? power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable device
for use in battery and load management.
A thermally enhanced large pad leadframe has been
incorporated into the standard SOT-23 package to produce
a HEXFET Power MOSFET with the industry's smallest
footprint. This package, dubbed the Micro3 ? , is ideal for
applications where printed circuit board space is at a
premium. The low profile (<1.1mm) of the Micro3 allows it
to fit easily into extremely thin application environments
such as portable electronics and PCMCIA cards. The thermal
resistance and power dissipation are the best available.
Absolute Maximum Ratings
Micro3 ?
Parameter
Max.
Units
V DS
I D @ T A = 25°C
I D @ T A = 70°C
I DM
P D @T A = 25°C
P D @T A = 70°C
V GS
T J, T STG
Drain- Source Voltage
Continuous Drain Current, V GS @ 4.5V
Continuous Drain Current, V GS @ 4.5V
Pulsed Drain Current ?
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
20
4.2
3.4
33
1.25
0.8
0.01
± 12
-55 to + 150
V
A
W
W/°C
V
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JA
Maximum Junction-to-Ambient ?
75
100
°C/W
www.irf.com
1
04/30/03
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