参数资料
型号: IRLMS5703TR
厂商: International Rectifier
文件页数: 1/9页
文件大小: 0K
描述: MOSFET P-CH 30V 2.3A 6-TSOP
标准包装: 1
系列: HEXFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2.3A
开态Rds(最大)@ Id, Vgs @ 25° C: 200 毫欧 @ 1.6A,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 11nC @ 10V
输入电容 (Ciss) @ Vds: 170pF @ 25V
功率 - 最大: 1.7W
安装类型: 表面贴装
封装/外壳: 6-LSOP(0.063",1.60mm 宽)
供应商设备封装: Micro6?(TSOP-6)
包装: 剪切带 (CT)
其它名称: *IRLMS5703TR
IRLMS5703
IRLMS5703CT
PD - 91413 E
IRLMS5703
HEXFET ? Power MOSFET
l
l
l
l
Generation V Technology
Micro6 Package Style
Ultra Low Rds(on)
P-Channel MOSFET
D
D
1
2
6
5
A
D
D
V DSS = -30V
Description
Fifth Generation HEXFETs from International Rectifier
G
3
T op V iew
4
S
R DS(on) = 0.20 ?
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The Micro6 package with its customized leadframe
produces a HEXFET power MOSFET with Rds(on)
60% less than a similar size SOT-23. This package is
ideal for applications where printed circuit board space
is at a premium. It's unique thermal design and R DS(on)
reduction enables a current-handling increase of nearly
300% compared to the SOT-23.
Absolute Maximum Ratings
M icro 6
Parameter
Max.
Units
I D @ T A = 25°C
Continuous Drain Current, V GS @ -10V
-2.3
I D @ T A = 70°C
I DM
P D @T A = 25°C
V GS
dv/dt
T J, T STG
Continuous Drain Current, V GS @- 10V
Pulsed Drain Current ?
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ?
Junction and Storage Temperature Range
-1.9
-13
1.7
13
± 20
5.0
-55 to + 150
A
W
mW/°C
V
V/ns
°C
Thermal Resistance Ratings
Parameter
Min.
Typ.
Max
Units
R θ JA
Maximum Junction-to-Ambient ?
–––
–––
75
°C/W
4/7/04
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