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参数资料
| 型号： | ISL6236EVAL2 |
| 厂商： | Intersil |
| 文件页数： | 34/35页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD 2 FOR ISL6236 |
| 标准包装： | 1 |
| 系列： | * |
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ISL6236
Mount all of the power components on the top side of the board
with their ground terminals flush against one another, if
possible. Follow these guidelines for good PC board layout:
? Isolate the power components on the top side from the
sensitive analog components on the bottom side with a
ground shield. Use a separate PGND plane under the
OUT1 and OUT2 sides (called PGND1 and PGND2). Avoid
the introduction of AC currents into the PGND1 and PGND2
ground planes. Run the power plane ground currents on the
top side only, if possible.
? Use a star ground connection on the power plane to
minimize the crosstalk between OUT1 and OUT2.
? Keep the high-current paths short, especially at the
ground terminals. This practice is essential for stable,
jitter-free operation.
? Keep the power traces and load connections short. This
practice is essential for high efficiency. Using thick copper
PC boards (2oz vs 1oz) can enhance full-load efficiency
by 1% or more. Correctly routing PC board traces must be
approached in terms of fractions of centimeters, where a
single m Ω of excess trace resistance causes a
measurable efficiency penalty.
? PHASE (ISL6236) and GND connections to the
synchronous rectifiers for current limiting must be made
using Kelvin-sense connections to guarantee the
current-limit accuracy with 8 Ld SO MOSFETs. This is best
done by routing power to the MOSFETs from outside using
the top copper layer, while connecting PHASE traces
inside (underneath) the MOSFETs.
? When trade-offs in trace lengths must be made, it is
preferable to allow the inductor charging path to be made
longer than the discharge path. For example, it is better to
allow some extra distance between the input capacitors
and the high-side MOSFET than to allow distance
between the inductor and the synchronous rectifier or
between the inductor and the output filter capacitor.
? Ensure that the OUT connection to COUT is short and
direct. However, in some cases it may be desirable to
deliberately introduce some trace length between the OUT
connector node and the output filter capacitor.
? Route high-speed switching nodes (BOOT, UGATE,
PHASE, and LGATE) away from sensitive analog areas
(REF, ILIM, and FB). Use PGND1 and PGND2 as an EMI
shield to keep radiated switching noise away from the IC's
feedback divider and analog bypass capacitors.
Layout Procedure
Place the power components first with ground terminals
adjacent (Q 2 /Q 4 source, C IN , C OUT ). If possible, make all
these connections on the top layer with wide, copper-filled
areas.
Mount the controller IC adjacent to the synchronous rectifier
MOSFETs close to the hottest spot, preferably on the back
side in order to keep UGATE, GND, and the LGATE gate
drive lines short and wide. The LGATE gate trace must be
short and wide, measuring 50 mils to 100 mils wide if the
MOSFET is 1” from the controller device.
Group the gate-drive components (BOOT capacitor, VIN
bypass capacitor) together near the controller device.
Make the DC/DC controller ground connections as follows:
1. Near the device, create a small analog ground plane.
2. Connect the small analog ground plane to GND and use
the plane for the ground connection for the REF and VCC
bypass capacitors, FB dividers and ILIM resistors (if any).
3. Create another small ground island for PGND and use
the plane for the VIN bypass capacitor, placed very close
to the device.
4. Connect the GND and PGND planes together at the
metal tab under device.
On the board's top side (power planes), make a star ground
to minimize crosstalk between the two sides. The top-side
star ground is a star connection of the input capacitors and
synchronous rectifiers. Keep the resistance low between the
star ground and the source of the synchronous rectifiers for
accurate current limit. Connect the top-side star ground
(used for MOSFET, input, and output capacitors) to the small
island with a single short, wide connection (preferably just a
via). Create PGND islands on the layer just below the
topside layer (refer to the ISL6236 Evaluation Kit Application
Notes, AN1271 and AN1272) to act as an EMI shield if
multiple layers are available (highly recommended). Connect
each of these individually to the star ground via, which
connects the top side to the PGND plane. Add one more
solid ground plane under the device to act as an additional
shield, and also connect the solid ground plane to the star
ground via.
Connect the output power planes (VCORE and system
ground planes) directly to the output filter capacitor positive
and negative terminals with multiple vias.
? Make all pin-strap control input connections (SKIP, ILIM,
etc.) to GND or VCC of the device.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
34
FN6373.6
April 29, 2010
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL6236IRZA | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:High-Efficiency, Quad-Output, Main Power Supply Controllers for Notebook Computers |
| ISL6236IRZAR5281 | 功能描述:IC MAIN PWR CTRLR QUAD 32-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 标准包装:43 系列:- 应用:控制器，Intel VR11 输入电压:5 V ~ 12 V 输出数:1 输出电压:0.5 V ~ 1.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-VFQFN 裸露焊盘 供应商设备封装:48-QFN（7x7） 包装:管件 |
| ISL6236IRZA-T | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:High-Efficiency, Quad-Output, Main Power Supply Controllers for Notebook Computers |
| ISL6236IRZA-TKR5281 | 功能描述:IC QUAD OUT POWER CONTROL 32-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 标准包装:2,000 系列:- 应用:控制器，DSP 输入电压:4.5 V ~ 25 V 输出数:2 输出电压:最低可调至 1.2V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:30-TFSOP（0.173"，4.40mm 宽） 供应商设备封装:30-TSSOP 包装:带卷 (TR) |
| ISL6236IRZA-TR5281 | 功能描述:IC MAIN PWR CTRLR QUAD 32-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 标准包装:43 系列:- 应用:控制器，Intel VR11 输入电压:5 V ~ 12 V 输出数:1 输出电压:0.5 V ~ 1.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-VFQFN 裸露焊盘 供应商设备封装:48-QFN（7x7） 包装:管件 |
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