参数资料
型号: ISL6336AIRZ
厂商: Intersil
文件页数: 24/31页
文件大小: 0K
描述: IC CTRLR PWM 6PHASE BUCK 48-QFN
标准包装: 43
应用: 控制器,Intel VR11.1
输入电压: 3 V ~ 12 V
输出数: 1
输出电压: 0.5 V ~ 1.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-VFQFN 裸露焊盘
供应商设备封装: 48-QFN(7x7)
包装: 管件
ISL6336, ISL6336A
Based on the VCC voltage, ISL6336, ISL6336A converts the
TM pin voltage to a 6-bit digital signal for temperature
compensation. With the non-linear A/D converter of ISL6336,
7. Choose the pull-up resistor R TC1 (typical 10k Ω );
8. If N = 15, do not need the pull-down resistor R TC2 ,
otherwise obtain R TC2 by Equation 25:
R TC2 = -----------------------
ISL6336A, the TM digital signal is linearly proportional to the
NTC temperature. For accurate temperature compensation,
the ratio of the TM voltage to the NTC temperature of the
NxR TC1
15 – N
(EQ. 25)
practical design should be similar to that in Figure 15.
Depending on the location of the NTC and the air-flowing,
the NTC may be cooler or hotter than the current sense
component. The TCOMP pin voltage can be utilized to
correct the temperature difference between the NTC and the
current sense component. When a different NTC type or
different voltage divider is used for the TM function, the
TCOMP voltage can also be used to compensate for the
difference between the recommended TM voltage curve in
Figure 16 and that of the actual design. According to the
VCC voltage, ISL6336, ISL6336A converts the TCOMP pin
voltage to a 4-bit TCOMP digital signal as TCOMP factor N.
TCOMP factor N is an integer between 0 and 15. The
integrated temperature compensation function is disabled for
N = 0. For N = 4, the NTC temperature is equal to the
temperature of the current sense component. For N < 4, the
NTC is hotter than the current sense component. The NTC is
cooler than the current sense component for N > 4. When
9. Run the actual board under full load again with the proper
resistors to TCOMP pin.
10. Record the output voltage as V1 immediately after the
output voltage is stable with the full load; Record the
output voltage as V2 after the VR reaches the thermal
steady state.
11. If the output voltage increases over 2mV as the
temperature increases, i.e. V2 - V1 >2mV, reduce N and
redesign R TC2 ; if the output voltage decreases over 2mV
as the temperature increases, i.e. V1 - V2 >2mV,
increase N and redesign R TC2 .
A design spreadsheet is available to speed aid calculations.
External Temperature Compensation
By pulling the TCOMP pin to GND, the integrated
temperature compensation function is disabled. In addition,
one external temperature compensation network, shown in
Figure 18, can be used to cancel the temperature impact on
the droop (i.e. load line).
N > 4, the larger TCOMP factor N, the larger the difference
between the NTC temperature and the temperature of the
COMP
ISL6336,
ISL6336A
INTERNAL
current sense component.
ISL6336, ISL6336A multiplexes the TCOMP factor N with the
TM digital signal to obtain the adjustment gain to compensate
FB
CIRCUIT
the temperature impact on the sensed channel current. The
compensated channel current signal is used for droop and
overcurrent protection functions.
Design Procedure
1. Properly choose the voltage divider for TM pin to match
o
C
VDIFF
R NTC ( T ) = -------------------------------- (EQ. 23)
V CC – V
TM
the TM voltage vs temperature curve with the
recommended curve in Figure 15.
2. Run the actual board under the full load and the desired
cooling condition.
3. After the board reaches the thermal steady state, record
the temperature (T CSC ) of the current sense component
(e.g., inductor) and the voltage at TM and VCC pins.
4. Use Equation 23 to calculate the resistance of the TM
NTC, and find out the corresponding NTC temperature
T NTC from the NTC datasheet.
V TM xR TM1
NTC
5. Use Equation 24 to calculate the TCOMP factor N:
FIGURE 18. EXTERNAL TEMPERATURE COMPENSATION
The sensed current will flow out of the FB pin and develop the
droop voltage across the resistor (R FB ) between FB and
VDIFF pins. If the R FB resistance reduces as the temperature
increases, the temperature impact on the droop can be
compensated. An NTC thermistor can be placed close to the
power stage and used to form R FB . Due to the non-linear
temperature characteristics of the NTC, a resistor network is
needed to make the equivalent resistance between FB and
VDIFF pin reverse proportional to the temperature.
The external temperature compensation network can only
compensate the temperature impact on the droop, while it
has no impact to the sensed current inside ISL6336,
209x ( T CSC – T
N = -------------------------------------------------------- + 4
NTC
3xT NTC + 400
)
(EQ. 24)
ISL6336A. Therefore this network cannot compensate for
the temperature impact on the overcurrent protection
function.
6. Choose an integral number close to the above result for
the TCOMP factor. If this factor is higher than 15, use
N = 15. If it is less than 1, use N = 1.
24
FN6504.1
May 28, 2009
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