参数资料
型号: ISL8104EVAL2Z
厂商: Intersil
文件页数: 8/14页
文件大小: 0K
描述: EVAL BOARD 2 FOR ISL8104
标准包装: 1
系列: *
ISL8104
will repeat this process in a hiccup mode. Figure 4 shows a
typical reaction to a repeated overcurrent condition that
places the regulator in a hiccup mode. If the regulator is
repeatedly tripping overcurrent, the hiccup period can be
approximated by Equation 5:
temperature range. System Accuracy includes Error Amplifier
offset, and Reference Error. The use of REFIN may add up to
3mV of offset error into the system (as the Error Amplifier
offset is trimmed out via the internal System reference).
t HICCUP = --------------------------------
2 ? 4V ? C SS
30 μ A
(EQ. 5)
Application Guidelines
Layout Considerations
The OCP trip point varies mainly due to MOSFET r DS(ON)
variations and layout noise concerns. To avoid overcurrent
tripping in the normal operating load range, find the R OCSET
resistor from the following equations with:
1. The maximum r DS(ON) at the highest junction
temperature
2. The minimum I TSOC from the specification table
Determine the overcurrent trip point greater than the
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
R TSOC = ----------------------------------------------------------------
maximum output continuous current at maximum inductor
ripple current.
SIMPLE OCP EQUATION
I OC_SOURCE ? r DS ( ON )
200 μ A
DETAILED OCP EQUATION
VCC
PVCC
ISL8104
+14V
C BP_PVCC
C BP_VCC
VIN
? I
+ ----- ? ? r
---------------------------------------------------------------------------------- )
? OC_SOURCE 2 ?
R TSOC =
Δ I
I TSOC ? N T
DS ( ON
TGATE
BOOT
Q 1
C IN
V IN - V OUT V OUT
f SW ? L OUT
N T =  NUMBER OF TOP-SIDE  MOSFETs
Δ I = -------------------------------- ? ----------------
V IN
f SW = Regulator Switching Frequency
(EQ. 6)
LX
C IN
L OUT
C OUT
V OUT
High Speed MOSFET Gate Driver
BGATE
Q 2
GND
SS
PGND
C SS
Reference Input
The REFIN pin allows the user to bypass the internal 0.597V
reference with an external reference. If REFIN is NOT above
~2.2V, the external reference pin is used as the control
reference instead of the internal 0.597V reference. When not
using the external reference option, the REFIN pin should be
left floating. An internal 6μA pull-up keeps this REFIN pin
above 2.2V in this situation.
Internal Reference and System Accuracy
The Internal Reference is set to 0.597V. The total DC system
accuracy of the system is to be within 1.5% over the industrial
8
KEY
TRACE SIZED FOR 3A PEAK CURRENT
SHORT TRACE, MINIMUM IMPEDANCE
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 5. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
A multi-layer printed circuit board is recommended. Figure 5
shows the critical components of the converter. Note that
capacitors C IN and C OUT could each represent numerous
physical capacitors. Dedicate one solid layer (usually a middle
layer of the PC board) for a ground plane and make all critical
component ground connections with vias to this layer.
Dedicate another solid layer as a power plane and break this
plane into smaller islands of common voltage levels. Keep the
metal runs from the LX terminals to the output inductor short.
FN9257.2
March 7, 2008
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