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| 型号： | KIT33887PNBEVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 7/37页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL 33887 5A H-BRIDGE PQFN |
| 标准包装： | 1 |
| 主要目的： | 电源管理，H 桥驱动器（内部 FET） |
| 嵌入式： | 否 |
| 已用 IC / 零件： | MC33887 |
| 主要属性： | 5A 5 ~ 28V PWM 至 20kHz 有源电流限制 |
| 次要属性： | 故障状态，睡眠模式，比例电流镜像输出 |
| 已供物品： | 板，CD |
| 相关产品： | MC33887DWBR2-ND - IC H-BRIDGE 5A LOAD FDBK 54-SOIC MC33887VWR2-ND - IC H-BRIDGE 5.0A W/CS 20-HSOP MC33887PNBR2-ND - IC H-BRIDGE 5A CURR FDBK 36-PQFN MC33887PNB-ND - IC H-BRIDGE CURR FDBK 5A 36-PQFN MC33887DHR2-ND - IC H-BRIDGE 5A CURR FDBK 20-HSOP MC33887VW-ND - IC H-BRIDGE 5.0A W/CS 20-HSOP MC33887DWB-ND - IC H-BRIDGE 5.0A W/CS 54-SOIC MC33887DH-ND - IC H-BRIDGE 5.0A W/CS 20-HSOP |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage (1)
V+
-0.3 to 40
V
Input Voltage
V IN
- 0.3 to 7.0
V
FS Status Output (3)
Continuous Current (4)
ESD Voltage (5)
Human Body Model
Machine Model
V FS
I OUT
V ESD1
V ESD2
-0.3 to 7.0
5.0
± 2000
± 200
V
A
V
THERMAL RATINGS
Storage Temperature
T STG
- 65 to 150
° C
Operating Temperature
Ambient
Junction
T A
T J
- 40 to 125
- 40 to 150
° C
Peak Package Reflow Temperature During Reflow
T PPRT
°C
Notes
1 Performance at voltages greater than 28V is degraded.See Electrical Performance Curves on page 18 and 19 for typical performance.
Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime.
2 Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3 Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4 Continuous current capability so long as junction temperature is ≤ 150 ° C.
5 ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 Ω ), ESD2 testing is performed in
accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 Ω ).
6
7
8.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
nonrepetitive excursions of junction temperature above 150 ° C can be tolerated as long as duration does not exceed 30 seconds
maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.)
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
33887
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
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