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参数资料
| 型号： | LFM34INTPU1A |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 49/60页 |
| 文件大小： | 0K |
| 描述： | ADAPTER MPC5534 324-BGA |
| 标准包装： | 1 |
| 模块/板类型： | 适配器板 |
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Revision History for the MPC5534 Data Sheet
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
53
5.3
Changes Between Revisions 3.0 and 4.0
The following table lists the substantive text changes made to paragraphs.
Last paragraph: Changed the first sentence FROM . . . the voltage on the pins goes to high-impedance until . . .
TO. . .the pins go to a high-impedance state until . . .
Table 29. Text Changes Between Rev. 3.0 and 4.0
Location
Description of Changes
Title Page:
Changed the Revision number from 3.0 to 4.0. Changed the date format to DD MMM YYYY. Made the same
changes in the lower left corner of the back page.
Added the sentence directly preceding Table 1: ‘Unless noted in this data sheet, all specifications apply
from TL to TH.’
Sections 3.7.1, 3.7.2 and 3.7.3: Reordered sections resulting in the following order and section renumbering:
Added the following text directly before this section and after Table 8 Pin Status for Medium and Slow Pads During
the Power-on Sequence:
‘The values in Table 7 and Table 8 do not include the effect of the weak pull devices on the output pins during
power up.
Before exiting the internal POR state, the voltage on the pins goes to high-impedance until POR negates. When
the internal POR negates, the functional state of the signal during reset applies and the weak pull devices (up
or down) are enabled as defined in the device Reference Manual. If VDD is too low to correctly propagate the
logic signals, the weak-pull devices can pull the signals to VDDE and VDDEH.
To avoid this condition, minimize the ramp time of the VDD supply to a time period less than the time required to
enable the external circuitry connected to the device outputs.’
Section 3.7.3, “Power-Down Sequence (VRC33 Grounded)” Deleted the underscore in ORed_POR to become ORed POR.
Table 28. Text Changes Between Rev. 4.0 and 5.0 (continued)
Location
Description of Changes
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相关代理商/技术参数 |
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| LFM-39A | 制造商:Leader 功能描述: |
| LFM53INTPU1A | 功能描述:IC 与器件插座 MPC5553 324-PIN BGA TO P RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| LFM53INTPWA | 功能描述:IC 与器件插座 MPC5553 416-PIN BGA TO P RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| LFM54INTPWA | 功能描述:插座和适配器 PB-FREE MPC5554 BGA TO P RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| LFM65INTPU1A | 功能描述:插座和适配器 PBSN MPC5565 324 BGA TO RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
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