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| 型号： | LFM34INTPU1A |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 54/60页 |
| 文件大小： | 0K |
| 描述： | ADAPTER MPC5534 324-BGA |
| 标准包装： | 1 |
| 模块/板类型： | 适配器板 |
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MPC5534 Microcontroller Data Sheet, Rev. 6
Revision History for the MPC5534 Data Sheet
Freescale Semiconductor
58
Table 25, eMIOS Timing:
Deleted (MTS) from the heading, table, and footnotes.
Footnote 1: Changed ‘VDDEH = 3.0–5.5;’ to ‘VDDEH = 3.0–5.25;’
Footnote 1: Deleted ‘FSYS = 80 MHz,’ ‘VDD = 1.35–1.65 V’, ‘VDD33 and VDDSYN = 3.0–3.6 V’ and
‘and CL = 200 pF with SRC = 0b11.’
Added Footnote 2: ‘This specification does not include the rise and fall times. When calculating the minimum
eMIOS pulse width, include the rise and fall times defined in the slew rate control fields (SRC) of the pad
configuration registers (PCR).’
Figure 17, eMIOS Timing: Added figure.
Table 26, DSPI Timing:
Table Title: Added footnote that reads: Speed is the nominal maximum frequency. Max speed is the maximum
speed allowed including frequency modulation (FM). 42 MHz parts allow for 40 MHz system clock + 2% FM;
68 MHz parts allow for 66 MHz system clock + 2% FM, and 82 MHz parts allow for 80 MHz system clock + 2% FM.
Spec1:SCK Cycle Time: changes to values: 40 MHz, min. = 48.8 ns, max = 5.8 ms; 66 MHz, min. = 28.4 ns,
max = 3.5 ms; 80 MHz min. = 24.4 ns, max = 2.9 ms.
Spec 2: PCS to SCK delay: 40 MHz, min. = 46 ns; 66 MHz, min. = 26 ns; 80 MHz min. = 22 ns.
Spec 3: After SCK delay: 40 MHz, min. = 45 ns; 66 MHz, min. = 25 ns; 80 MHz min. = 21 ns.
Spec 9: Data setup time for inputs, Master (MTFE = 1, CPHA = 0): 66 MHz, min. = 6 ns; 80 MHz min. = 8 ns.
Spec 10: Data hold time for inputs, Master (MTFE = 1, CPHA = 0): 40 MHz, min. = 45 ns; 66 MHz, min. = 25 ns;
80 MHz min. = 21 ns.
Spec 11: Data valid (after SCK edge), Master (MTFE = 1, CPHA = 0): 40 MHz, max. = 45 ns;
66 MHz, max. = 25 ns; 80 MHz max. = 21 ns.
Footnote 1: Changed ‘VDDEH = 3.0–5.5;’ to ‘VDDEH = 3.0–5.25;’
Footnote 1: Added to beginning of footnote 1 ‘All DSPI timing specifications use the fastest slew rate (SRC =
0b11) on pad type M or MH. DSPI signals using pad types of S or SH have an additional delay based on the slew
rate.’
Footnote 1: Deleted ‘VDD = 1.35–1.65 V’ and ‘VDD33 and VDDSYN = 3.0–3.6 V.
Table 27, EQADC SSI Timing Characteristics:
Footnote 1: Changed ‘VDDEH = 3.0–5.5;’ to ‘VDDEH = 3.0–5.25;’
Deleted from table title ‘(Pads at 3.3 V or 5.0 V)’
Deleted 1st line in table ‘CLOAD = 25 pF on all outputs. Pad drive strength set to maximum.’
Spec 1: FCK frequency -- removed.
Combined footnotes 1 and 2, and moved the new footnote to Spec 2. Moved old footnote 3 that is now
footnote 2 to Spec 2.
Footnote 1, deleted ‘VDD = 1.35–1.65 V’ and ‘VDD33 and VDDSYN = 3.0–3.6V.’
Changed ‘CL = 50 pF’ to ‘CL = 25 pF.’
Footnote 2: added ‘cycle’ after ‘duty’ to read: FCK duty cycle is not 50% when . . . .
Figure 28, MPC5534 208 Package and Figure 29 MPC5534 324 Package: Deleted the version number and date.
Figure 30, MPC5534 208 Package Dimensions and Figure 31 MPC5534 324 Package Dimensions:
Deleted the version number and date.
Table 30. Table and Figure Changes Between Rev. 3.0 and 4.0 (continued)
Location
Description of Changes
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| LFM-39A | 制造商:Leader 功能描述: |
| LFM53INTPU1A | 功能描述:IC 与器件插座 MPC5553 324-PIN BGA TO P RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| LFM53INTPWA | 功能描述:IC 与器件插座 MPC5553 416-PIN BGA TO P RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| LFM54INTPWA | 功能描述:插座和适配器 PB-FREE MPC5554 BGA TO P RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| LFM65INTPU1A | 功能描述:插座和适配器 PBSN MPC5565 324 BGA TO RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
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