参数资料
型号: LPC2294JBD144,551
厂商: NXP Semiconductors
文件页数: 22/54页
文件大小: 0K
描述: IC ARM7 MCU FLASH 256K 144-LQFP
标准包装: 60
系列: LPC2200
核心处理器: ARM7
芯体尺寸: 16/32-位
速度: 60MHz
连通性: CAN,EBI/EMI,I²C,Microwire,SPI,SSI,SSP,UART/USART
外围设备: POR,PWM,WDT
输入/输出数: 112
程序存储器容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 容量: 16K x 8
电压 - 电源 (Vcc/Vdd): 1.65 V ~ 3.6 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 105°C
封装/外壳: 144-LQFP
包装: 托盘
配用: OM10091-ND - KIT DEV PHYCORE-ARM7/LPC2220
568-1757-ND - BOARD EVAL FOR LPC220X ARM MCU
其它名称: 568-1898
935275728551
LPC2294JBD144-S
LPC2292_2294
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 8 June 2011
29 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
7.
Limiting values
[1]
The following applies to Table 6:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Internal rail.
[3]
External rail.
[4]
Including voltage on outputs in 3-state mode.
[5]
Only valid when the VDD(3V3) supply voltage is present.
[6]
Not to exceed 4.6 V.
[7]
Per supply pin.
[8]
The peak current is limited to 25 times the corresponding maximum current.
[9]
Per ground pin.
[10] Dependent on package type.
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k
series resistor.
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(1V8)
supply voltage (1.8 V)
0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
0.5
+3.6
V
VDDA(3V3)
analog supply voltage (3.3 V)
0.5
+4.6
V
VIA
analog input voltage
0.5
+5.1
V
VI
input voltage
5 V tolerant I/O pins
0.5
+6.0
V
other I/O pins
0.5
VDD(3V3) + 0.5
V
IDD
supply current
100
mA
ISS
ground current
100
mA
Tj
junction temperature
-
150
C
Tstg
storage temperature
65
+150
C
Ptot(pack)
total power dissipation (per
package)
based on package heat
transfer, not device
power consumption
-1.5
W
Vesd
electrostatic discharge voltage
human body model
all pins
2000
+2000
V
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