参数资料
型号: M1A3PE1500-FGG676I
厂商: Microsemi SoC
文件页数: 98/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 1.5M 676-FBGA
标准包装: 40
系列: ProASIC3E
RAM 位总计: 276480
输入/输出数: 444
门数: 1500000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
ProASIC3E DC and Switching Characteristics
2-26
Revision 13
3.3 V LVCMOS Wide Range
Table 2-29 Minimum and Maximum DC Input and Output Levels
3.3 V
LVCMOS
Wide
Range
Equivalent
Software
Default
Drive
Strength
Option1
VIL
VIH
VOL
VOH
IOL IOH IOSL
IOSH
IIL2 IIH3
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VA A
Max.
mA4
Max.
mA4
A5 A5
100 A
2 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
27
25
10 10
100 A
4 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
27
25
10 10
100 A
6 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
54
51
10 10
100 A
8 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
54
51
10 10
100 A
12 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
109
103
10 10
100 A
16 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
127
132
10 10
100 A
24 mA
–0.3
0.8
2
3.6
0.2
VDD – 0.2 100 100
181
268
10 10
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 A. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN< VCCI. Input current is
larger when operating outside recommended ranges.
4. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
5. Currents are measured at 85°C junction temperature.
6. Software default selection highlighted in gray.
Figure 2-7 AC Loading
Table 2-30 3.3 V LVCMOS Wide Range AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
0
3.3
1.4
35
Note: *Measuring point = Vtrip. See Table 2-15 on page 2-18 for a complete table of trip points.
Test Point
Enable Path
Datapath
35 pF
R = 1 k
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
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