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| 型号： | M52259EVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 27/46页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR 52259 COLDFIRE V2 |
| 产品培训模块： | ColdFire MCF5225x |
| 标准包装： | 1 |
| 系列： | ColdFire® |
| 类型： | MCU |
| 适用于相关产品： | MCF52259 |
| 所含物品： | 板，线缆，文档，DVD，闪光灯驱动和电源 |
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Electrical Characteristics
Table 8. Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
42
100 LQFP
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
? JA
? JA
? JMA
? JMA
53 13,14
39 1,15
1,3
33 1,3
? C / W
? C / W
? C / W
? C / W
Junction to board
—
? JB
25
? C / W
9
2
Junction to case
Junction to top of package
—
Natural convection
? JC
? jt
? C / W
? C / W
Maximum operating junction temperature
—
T j
105
o
C
1
? JA and ? jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of ? JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the ? jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
7 ? JA and ? jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of ? JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the ? jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
8 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
9
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
10 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
11 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
12 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
13
? JA and ? jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of ? JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the ? jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
14 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
15
27
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
MCF52259 ColdFire Microcontroller, Rev. 5
Freescale
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相关代理商/技术参数 |
参数描述 |
|---|---|
| M52259EVB | 制造商:Freescale Semiconductor 功能描述:MCF5225x Evaluation Board |
| M5226P | 制造商:Panasonic Industrial Company 功能描述:IC |
| M5226PFP | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:5-ELEMENT GRAPHIC EQUALIZER IC |
| M52277EVB | 功能描述:开发板和工具包 - 其他处理器 EVAL BOARD FOR THE M52277x RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| M5228FP | 制造商:Panasonic Industrial Company 功能描述:IC |
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